TSM250NB06DCR RLG

TSM250NB06DCR RLG

$1.51
  • Description:MOSFET 2N-CH 60V 7A 8PDFN
  • Series:-

SKU:0e5213a46575 Category: Brand:

  
  • Quantity
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Product Detailed Parameters

  • Description:MOSFET 2N-CH 60V 7A 8PDFN
  • Series:-
  • Mfr:Taiwan Semiconductor Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 N-Channel (Dual)
  • FET Feature:-
  • Drain to Source Voltage (Vdss):60V
  • Current - Continuous Drain (Id) @ 25°C:7A (Ta), 30A (Tc)
  • Rds On (Max) @ Id, Vgs:25mOhm @ 7A, 10V
  • Vgs(th) (Max) @ Id:4V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:22nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds:1461pF @ 30V
  • Power - Max:2W (Ta), 48W (Tc)
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-PowerTDFN
  • Supplier Device Package:8-PDFN (5x6)
  • Grade:-
  • Qualification:-

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TSM250NB06DCR RLG

Overview

The TSM250NB06DCR is a dual N-channel power MOSFET manufactured by Taiwan Semiconductor Corporation. It features a PDFN56 Dual package and supports a drain-source voltage of 60V with a continuous drain current of 30A at case temperature. The device achieves a maximum on-resistance of 25mΩ at VGS=10V and 31.6mΩ at VGS=7V. Key electrical parameters include a total gate charge of 22nC, an input capacitance of 1461pF, and a junction-to-case thermal resistance of 2.6°C/W. The component operates within a junction temperature range of -55°C to +150°C.

Feature Summary

  • Dual N-Channel configuration for space-efficient designs
  • Low RDS(ON) characteristics to minimize conductive losses
  • Optimized gate charge for fast power switching applications
  • Validated through 100% UIS and Rg testing

Applications

  • BLDC Motor Control
  • Battery Power Management
  • DC-DC Converter
  • Secondary Synchronous Rectification

Procurement Notes

Verify the specific ordering code TSM250NB06DCR RLG against official Taiwan Semiconductor documentation to confirm the PDFN56 Dual packaging and 2,500pcs reel quantity. Ensure compliance with RoHS standards and IEC 61249-2-21 halogen-free requirements prior to procurement. Cross-reference datasheet version A1908 for accurate specifications.

Selection Notes

Select this component for applications requiring dual N-channel isolation in a compact footprint. Evaluate the 25mΩ on-resistance against thermal constraints, noting the 2.6°C/W junction-to-case thermal resistance. Confirm that the 60V breakdown voltage and 30A current rating align with the system's peak operational demands and duty cycles.

Part Context

This part belongs to the TSMxxxNB0x series of 60V N-Channel MOSFETs from Taiwan Semiconductor. It utilizes the PDFN56 Dual package, distinguishing it from single-channel variants like the TSM130NB06LCR or TSM230N06PQ56. The dual configuration allows for integrated circuit solutions in motor control and power management systems.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Verify pinout compatibility and electrical parameter overlaps with other dual N-channel MOSFETs before considering alternatives.

FAQ

What is the maximum junction temperature for the TSM250NB06DCR?

The operating junction temperature range is -55°C to +150°C.

Is the TSM250NB06DCR suitable for high-frequency switching?

Yes, it features low gate charge (22nC) and optimized switching times, making it suitable for fast power switching applications.

What is the thermal resistance from junction to ambient?

The junction-to-ambient thermal resistance (RθJA) is 61°C/W, based on mounting on a 1 in² pad of 2 oz copper.

TSM250NB06DCR RLGTSM250NB06DCR RLG
$1.51
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