TSPC603RVGH12LC

Overview

The TSPC603RVGH12LC is a RISC microprocessor based on the PowerPC 603e architecture, manufactured using advanced CMOS technology. It features a superscalar design capable of issuing up to three instructions per clock cycle and integrates dual 16 KB caches for instructions and data. The device supports a selectable 32-bit or 64-bit external data bus with a 32-bit address bus, providing a 4-Gbyte direct addressing range. It includes an IEEE 754 compatible floating-point unit and Memory Management Units (MMUs) with Translation Lookaside Buffers. The processor operates at a maximum internal frequency of 300 MHz and a bus frequency of 75 MHz, utilizing a HiTCE CBGA 255 package.

Feature Summary

• Superscalar execution pipeline supporting up to three instructions per clock cycle
• Integrated dual 16 KB physically addressed caches with MMUs and TLBs
• Software-controllable power-saving modes including Nap, Doze, and Sleep
• On-chip debug support and JTAG boundary-scan testability

Applications

• High-performance embedded processing systems requiring low power consumption
• Industrial control applications operating in full military temperature ranges
• Avionics and defense electronics demanding MIL-PRF-38535 compliance
• Network infrastructure equipment utilizing high-speed data transfer protocols

Procurement Notes

Verify that the specific ordering suffix corresponds to the required package type and screening level. Confirm compliance with MIL-STD-883 Class B or Atmel standards as specified for the variant. Ensure voltage requirements match the 2.5V core and 3.3V I/O specifications. Check for lead-free status restrictions if applicable to your assembly process. Validate thermal management requirements for the HiTCE CBGA package during system integration.

Selection Notes

Select this component when a PowerPC 603e compatible processor with enhanced performance and lower power dissipation is required. Consider the HiTCE CBGA 255 package for superior thermal characteristics compared to standard CBGA options. Evaluate the need for 64-bit data bus width versus 32-bit options based on system bandwidth requirements. Ensure the design accommodates the specific voltage tolerances for VDD, AVDD, and OVDD supplies.

Part Context

This device belongs to the PowerPC 603R family, which serves as a low-power implementation of the PowerPC 603e architecture. It maintains pin-to-pin compatibility with the 603e and 603P in Cerquad packages while offering improved performance metrics. The 603R utilizes a 0.29 µm CMOS process technology to achieve higher efficiency and reduced power consumption across various operating modes.

Replacement Considerations

Direct substitutes include other variants within the TSPC603R family such as TSXPC603RMGU12LC or TSPC603RVGSU14LC, provided the package and speed grades align with system requirements. Verify interface compatibility and thermal specifications when transitioning between different package types like CBGA 255 and CI-CGA 255.