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TSV912AID is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC OPAMP GP 2 CIRCUIT 8SOIC. Review the specifications below when checking this part for your BOM.
The TSV912AID is a dual operational amplifier manufactured by STMicroelectronics, featuring rail-to-rail input and output capabilities. It operates from a single supply voltage ranging from 2.5 V to 5.5 V. The device offers an 8 MHz gain-bandwidth product and a typical slew rate of 4.5 V/µs at 5 V. Key electrical characteristics include a maximum input offset voltage of 1.5 mV (A grade), a typical input bias current of 1 pA, and a quiescent current of 820 µA. It provides a typical output current of 35 mA and is unity gain stable.
Verify the specific package type, as the TSV912AID designation typically corresponds to the SOIC-8 package in STMicroelectronics nomenclature. Confirm that the 'A' suffix denotes the A-grade specification for input offset voltage limits. Ensure compatibility with the target PCB footprint and soldering profile for surface-mount installation.
Select this component when rail-to-rail performance is required on a single low-voltage supply. It is appropriate for designs needing moderate bandwidth with minimal power draw. Consider the A-grade offset voltage if precision is critical. Verify that the 35 mA output current meets load requirements and that the operating temperature range covers the application environment.
This part belongs to the TSV91x family of CMOS operational amplifiers. The family includes variants with different channel counts, such as the single-channel TSV911 and the quad-channel TSV914. All members share similar electrical characteristics, including the 8 MHz bandwidth and rail-to-rail I/O, but differ in pinout and total power consumption based on the number of amplifiers per package.
Compatible substitutes within the same family include the TSV911 (single channel) and TSV914 (quad channel). Cross-manufacturer replacements require verification of pin compatibility, electrical parameters, and package dimensions.
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