TZ325N484C2

Field Programmable Gate Array Overview

The Efinix TZ325N484C2 is a Topaz FPGA featuring the Quantum compute fabric. It operates within a commercial temperature range and supports up to +125°C for industrial variants. The device utilizes a 484-ball package configuration, providing necessary I/O interfaces for system integration. This component belongs to the Topaz family, designed for low-power applications requiring high-density logic resources.

Field Programmable Gate Array Feature Summary

• Integrates the proprietary Quantum compute fabric architecture
• Provides high-density logic resources with low power consumption
• Supports diverse I/O interface configurations via external packaging

Field Programmable Gate Array Applications

• Edge computing systems
• Wireless and RF infrastructure
• IoT sensor data aggregation

Field Programmable Gate Array Procurement Notes

Verify the specific suffix codes against official Efinix documentation to confirm temperature grade and package type. Ensure compatibility with required I/O standards before procurement. Cross-reference part numbers with authorized distributors to avoid counterfeit components. Confirm availability of development kits if prototyping is required.

Field Programmable Gate Array Selection Notes

Select this model when low power and high density are critical. Compare resource counts against Trion or Titanium families for optimal fit. Evaluate thermal requirements early in design. Consider package pinout constraints for PCB layout. Validate support for target application protocols through official datasheets.

Field Programmable Gate Array Part Context

This component is part of the Topaz FPGA family from Efinix. It shares the core Quantum fabric technology found across the portfolio. The Topaz series targets cost-sensitive and power-constrained applications. It complements the higher-performance Titanium and lower-cost Trion lines.

Field Programmable Gate Array Replacement Considerations

Check Efinix official substitution guides for compatible devices. Verify pin-to-pin compatibility if replacing existing designs. Review feature parity for logic resources and I/O capabilities. Consult distributor databases for current availability of alternative part numbers.