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The UC5601QP is a SCSI active terminator designed for Small Computer Systems Interface bus cables, providing precision resistive pull-up to a 2.9V reference for all 18 lines. It complies with SCSI and SCSI-2 standards, featuring an internal trimmed regulator that ensures termination current accuracy of ±3% and a typical termination impedance of 110 ohms. The device includes a logic command disconnect feature that turns off the regulator and disconnects terminating resistors to reduce standby power. Electrical specifications include a supply current of 17 mA in open termination mode and 400 mA when lines are at 0.5V. The output high voltage is typically 2.9V, with a maximum output current of -22.4 mA. The QP package offers a thermal resistance junction-to-leads of 15°C/W.
Verify the specific ordering suffix against the manufacturer's latest documentation to confirm package type and moisture sensitivity level. Ensure the component meets RoHS and environmental compliance standards required for the target assembly process. Cross-reference the part number with official distribution channels to validate authenticity and current production status before procurement.
Select this component for designs requiring precise 110-ohm termination across 18 SCSI lines. Consider the PLCC-28 package for its low thermal resistance properties suitable for high-density mounting. Evaluate the disconnect input threshold and hysteresis to ensure compatibility with the system's control logic levels for reliable power-down operations.
The UC5601 series serves as an active terminator solution for SCSI interfaces, replacing passive resistor networks to improve signal integrity. The UC5601QP variant specifically utilizes a Plastic Leaded Chip Carrier package, offering distinct thermal characteristics compared to SOIC or DIP alternatives within the same functional family.
UC5601DWP and UC5601N are functionally equivalent parts within the UC5601 family but utilize different packages (SOIC-28 and PDIP-24 respectively). Verify pinout compatibility and thermal management requirements when substituting these variants.