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UH10FT-E3/4W is listed in the Single Diodes range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE STANDARD 300V 10A TO220AC. Review the specifications below when checking this part for your BOM.
The UH10FT-E3/4W is an ultrafast recovery rectifier manufactured by Vishay General Semiconductor. It utilizes oxide planar chip junction technology and is housed in a TO-220AC package. The device supports a maximum repetitive peak reverse voltage of 300 V and a maximum average forward rectified current of 10 A. Key electrical parameters include a peak forward surge current of 180 A, a typical reverse recovery time of 25 ns, and a maximum instantaneous forward voltage of 1.2 V at 10 A. The component operates within a junction temperature range of -55 °C to +175 °C.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm the exact package type and delivery mode. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer before placing orders. Ensure thermal management requirements align with the specified thermal resistance values.
Select this component for circuits requiring fast switching speeds and low reverse recovery charge. Evaluate the thermal resistance and derating curves to ensure adequate heat dissipation under continuous load conditions. Verify that the operating voltage and current ratings exceed the circuit's maximum expected peaks to maintain reliability.
This part belongs to the UH(B)10FT series of ultrafast recovery rectifiers from Vishay. The series includes variants such as the UHB10FT, which shares similar electrical characteristics but utilizes a different surface-mount package (TO-263AB). Both variants are designed for high-efficiency power conversion applications.
The UHB10FT-E3/4W is a pin-compatible alternative offering identical electrical specifications in a TO-263AB surface-mount package. Verify footprint compatibility and mounting torque requirements when substituting between through-hole and surface-mount versions.
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