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Product Detailed Parameters
- Description：IC PWR RELAY 7NPN 1:1 16TSSOP
- Series：ULx200xA
- Mfr：Texas Instruments
- Package：Tape & Reel (TR),Cut Tape (CT)
- Transistor Type：-
- Current - Collector (Ic) (Max)：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Vce Saturation (Max) @ Ib, Ic：-
- Current - Collector Cutoff (Max)：-
- DC Current Gain (hFE) (Min) @ Ic, Vce：-
- Power - Max：-
- Frequency - Transition：-
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：16-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package：16-TSSOP
- Grade：-
- Qualification：-
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Overview
The ULN2003AIPWR is a high-voltage, high-current Darlington transistor array manufactured by Texas Instruments. It integrates seven NPN Darlington pairs with common emitters and integrated clamp diodes for inductive load switching. The device operates with a maximum continuous collector current of 500 mA per channel and withstands up to 50 V in the OFF state. It features series input resistors optimized for direct interfacing with 5 V TTL or CMOS logic. Packaged in a 16-lead PowerPAD TSSOP surface-mount outline, it supports an operating temperature range from -40°C to +125°C.
Feature Summary
- Integrates seven independent high-voltage Darlington pairs with common emitter configuration
- Includes integral cathode clamp diodes across each output and emitter for inductive load protection
- Features internal base resistors allowing direct interface with 5V TTL and CMOS logic families
Applications
- Relay drivers
- Stepping motor drivers
- High-current latching relay drivers
- Line drivers and logic buffers
Procurement Notes
Verify the specific suffix IPWR confirms the PowerPAD TSSOP package variant rather than standard TSSOP. Confirm the manufacturer source is Texas Instruments directly or authorized distribution channels to ensure component authenticity. Check revision levels against current datasheets as manufacturing processes may update over time.
Selection Notes
Select this component when driving multiple high-current loads such as relays or solenoids from low-power logic sources. The integrated input resistors simplify circuit design by eliminating external components. Ensure the thermal management strategy accounts for the PowerPAD thermal pad requirements inherent to this surface-mount package type.
Part Context
This part belongs to the ULN20xxA series of high-voltage, high-current Darlington arrays developed by Texas Instruments. It shares electrical characteristics with the through-hole ULN2003AN but utilizes a surface-mountable 16-lead PowerPAD TSSOP package. The series is designed for applications requiring robust switching capabilities beyond standard logic buffer limits.
Replacement Considerations
The ULN2003APWR is a compatible alternative within the same family using a standard TSSOP package without the exposed thermal pad. Verify pinout compatibility and thermal dissipation requirements before substituting between PowerPAD and standard TSSOP variants.
