VS-40CTQ045HN3

Diode Arrays Overview

The VS-40CTQ045HN3 is a dual Schottky diode array configured as a common cathode pair, manufactured by Vishay General Semiconductor. It features a maximum DC reverse voltage of 45 V and supports an average rectified current of 40 A per diode. The forward voltage is specified at 680 mV when conducting 40 A. Designed for through-hole mounting in TO-220AB packages, the component operates within a junction temperature range of -55°C to 150°C. It holds AEC-Q101 qualification for automotive reliability standards.

Diode Arrays Feature Summary

• Dual Schottky barrier rectifier configuration with common cathode connection
• AEC-Q101 qualified for automotive electronic applications
• High thermal performance suitable for high-current power conversion

Diode Arrays Applications

• Automotive power supply circuits
• DC-DC converter output rectification
• Freewheeling diodes in motor control systems

Diode Arrays Procurement Notes

Verify the specific suffix HN3 against the official Vishay datasheet to confirm package dimensions and pinout compatibility. Ensure the procurement source provides valid RoHS compliance documentation. Cross-reference the AEC-Q101 certification status if the application requires strict automotive grade validation. Confirm that the through-hole lead form matches the target PCB footprint requirements before finalizing orders.

Diode Arrays Selection Notes

Select this component for applications requiring high current handling in a dual-diode topology. The 45 V rating suits low-voltage DC systems. Consider the TO-220AB package size for adequate heat dissipation without additional heatsinks in moderate duty cycles. Compare forward voltage characteristics against alternative Schottky devices to optimize system efficiency losses under full load conditions.

Diode Arrays Part Context

This part belongs to Vishay's VS-40CTQ series of high-current Schottky rectifiers. The series is engineered for robust performance in power electronics. The HN3 suffix typically denotes specific packaging or tape-and-reel configurations within the broader product family. These components are widely used in industrial and automotive sectors where reliability under thermal stress is critical.