VS-ENQ030L120S

Overview

The VS-ENQ030L120S is a press-fit power module in the EMIPAK-1B package designed for neutral point clamp topologies. It integrates ultrafast Trench IGBTs and HEXFRED/SiC diodes. The 1200 V stage (Q1-Q4) has a typical VCE(ON) of 2.12 V at 30 A, while the 600 V stage (Q2-Q3) has a typical VCE(ON) of 1.42 V at 30 A. Both stages support a continuous collector current of 30 A at elevated case temperatures. The module includes an internal NTC thermistor with a resistance of 5 kΩ at 25 °C.

Feature Summary

• Integrated neutral point clamp topology combining 1200 V and 600 V Trench IGBTs with antiparallel diodes.
• Utilizes PressFit pins technology to eliminate soldering requirements and ensure reliable mechanical connection.
• Features an exposed Al2O3 substrate providing low thermal resistance for improved heat dissipation.
• Optimized layout minimizes stray inductances to enhance electromagnetic interference performance.

Applications

• High-frequency DC/DC converters
• Switching power supplies
• Freewheeling diode circuits
• OR-ing diode applications
• Reverse battery protection

Procurement Notes

Verify component authenticity by cross-referencing the document number 94684 and revision date 16-Jun-16 on official Vishay channels. Confirm that the ordering code matches the specific pin configuration and die technologies described in the datasheet. Ensure compliance with material categorization standards via the provided documentation link before finalizing acquisition.

Selection Notes

Select this module for designs requiring integrated neutral point clamp functionality without discrete assembly. Verify that the operating junction temperature remains within the 150 °C limit and that the gate drive voltage aligns with the specified thresholds. Consider the thermal impedance characteristics when designing the heatsink interface to maintain safe operating conditions under maximum load.

Part Context

This component belongs to the Vishay EMIPAK-1B series of press-fit power modules. It utilizes Ultrafast Trench IGBT technology combined with HEXFRED and silicon carbide diode technologies. The product is UL approved under file E78996 and complies with RoHS directives. It represents a specialized solution for high-efficiency power conversion systems.

Replacement Considerations

No public confirmed substitute part numbers are available in the source documentation. Direct replacement requires matching the EMIPAK-1B package dimensions, PressFit pin specifications, and electrical ratings of the integrated IGBT and diode stages.

FAQ

What is the function of the internal NTC thermistor?

The internal NTC thermistor provides temperature monitoring capabilities, featuring a resistance of 5000 Ω at 25 °C and a B-value of 3375 K.

How does the PressFit technology benefit the module installation?

PressFit pins allow for direct insertion into PCB holes without soldering, reducing assembly time and eliminating solder joint reliability issues associated with high-power modules.

What is the difference between the Q1-Q4 and Q2-Q3 stages?

Q1-Q4 are 1200 V Trench IGBTs, while Q2-Q3 are 600 V Trench IGBTs. This voltage differentiation supports the specific switching requirements of the neutral point clamp topology.