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VS-HFA30TA60CSTRLP is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE ARRAY GP 600V 15A TO263AB. Review the specifications below when checking this part for your BOM.
The VS-HFA30TA60CSTRLP is a HEXFRED ultrafast soft recovery diode manufactured by Vishay Semiconductors. It features a dual common cathode configuration with a 600 V reverse voltage rating and 15 A continuous forward current per leg. The device utilizes D2PAK (TO-263AB) surface-mount packaging and includes an 'L' suffix indicating left-oriented tape and reel delivery. Key electrical characteristics include a typical reverse recovery time of 19 ns, a maximum forward voltage drop of 1.7 V at 15 A, and a peak repetitive forward current capability of 60 A.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm the package type and reel orientation. The 'L' designation indicates left-oriented tape and reel packaging, which differs from right-oriented or tube configurations. Ensure compatibility with automated pick-and-place equipment specifications before finalizing procurement orders.
Select this component when circuit designs require ultrafast recovery times combined with soft recovery waveforms to suppress voltage spikes. The D2PAK package provides efficient thermal dissipation through the exposed pad. Evaluate junction temperature limits and thermal resistance parameters to ensure reliable operation under expected load conditions.
This part belongs to the HEXFRED family of ultrafast soft recovery diodes produced by Vishay General Semiconductor - Diodes Division. The product line emphasizes superior performance metrics compared to standard rectifiers, specifically targeting applications where switching speed and efficiency are critical design constraints.
VS-HFA30TA60CS-M3
The 'L' suffix denotes that the components are supplied in a tape and reel format with left-oriented orientation.
No, the HEXFRED technology ensures the device does not exhibit any tendency to snap-off during the tail portion of the recovery cycle.
The maximum operating junction and storage temperature range extends up to +150 °C.
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