Diode Arrays VS-HFA30TA60CSTRLP product image

VS-HFA30TA60CSTRLP

  • Description:DIODE ARRAY GP 600V 15A TO263AB
  • Series:HEXFRED®

SKU:9d7041201511 Category: Brand:

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VS-HFA30TA60CSTRLP is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE ARRAY GP 600V 15A TO263AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for VS-HFA30TA60CSTRLP

  • Description:DIODE ARRAY GP 600V 15A TO263AB
  • Series:HEXFRED®
  • Mfr:Vishay General Semiconductor - Diodes Division
  • Package:Tape & Reel (TR)
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):600 V
  • Current - Average Rectified (Io) (per Diode):15A
  • Voltage - Forward (Vf) (Max) @ If:1.7 V @ 15 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):60 ns
  • Current - Reverse Leakage @ Vr:10 µA @ 600 V
  • Operating Temperature - Junction:-55°C ~ 150°C
  • Mounting Type:Surface Mount
  • Package / Case:TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
  • Supplier Device Package:TO-263AB (D2PAK)
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for VS-HFA30TA60CSTRLP

VS-HFA30TA60CSTRLP

Diode Arrays Overview

The VS-HFA30TA60CSTRLP is a HEXFRED ultrafast soft recovery diode manufactured by Vishay Semiconductors. It features a dual common cathode configuration with a 600 V reverse voltage rating and 15 A continuous forward current per leg. The device utilizes D2PAK (TO-263AB) surface-mount packaging and includes an 'L' suffix indicating left-oriented tape and reel delivery. Key electrical characteristics include a typical reverse recovery time of 19 ns, a maximum forward voltage drop of 1.7 V at 15 A, and a peak repetitive forward current capability of 60 A.

Diode Arrays Feature Summary

  • Ultrafast and ultrasoft recovery characteristics that minimize electromagnetic interference and reduce switching losses in both the diode and associated transistors.
  • Advanced epitaxial construction designed to eliminate snap-off behavior during the tail portion of the recovery cycle.
  • Low peak reverse recovery current and stored charge values, enabling reduced snubber requirements and lower component counts.
  • Qualified for MSL level 1 compliance with a maximum lead peak temperature of 245 °C.

Diode Arrays Applications

  • Companion diodes for IGBTs and MOSFETs in high-speed power conversion systems
  • High-frequency power supplies requiring low noise and high efficiency
  • Motor drive circuits demanding rapid switching capabilities

Diode Arrays Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm the package type and reel orientation. The 'L' designation indicates left-oriented tape and reel packaging, which differs from right-oriented or tube configurations. Ensure compatibility with automated pick-and-place equipment specifications before finalizing procurement orders.

Diode Arrays Selection Notes

Select this component when circuit designs require ultrafast recovery times combined with soft recovery waveforms to suppress voltage spikes. The D2PAK package provides efficient thermal dissipation through the exposed pad. Evaluate junction temperature limits and thermal resistance parameters to ensure reliable operation under expected load conditions.

Diode Arrays Part Context

This part belongs to the HEXFRED family of ultrafast soft recovery diodes produced by Vishay General Semiconductor - Diodes Division. The product line emphasizes superior performance metrics compared to standard rectifiers, specifically targeting applications where switching speed and efficiency are critical design constraints.

Diode Arrays Replacement Considerations

VS-HFA30TA60CS-M3

Diode Arrays FAQ

What does the 'L' suffix indicate in the part number?

The 'L' suffix denotes that the components are supplied in a tape and reel format with left-oriented orientation.

Does the device exhibit snap-off behavior during recovery?

No, the HEXFRED technology ensures the device does not exhibit any tendency to snap-off during the tail portion of the recovery cycle.

What is the maximum operating junction temperature?

The maximum operating junction and storage temperature range extends up to +150 °C.

VS-HFA30TA60CSTRLPVS-HFA30TA60CSTRLP

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