VSC7323VH

Overview

The VSC7323 is a high-density Ethernet MAC chip integrating ten triple-speed MACs with integrated SerDes and one 10 Gigabit Ethernet MAC with an integrated XAUI interface. It supports 10/100/1000 Mbps via MII, RGMII, or GMII, and 10 Gbps via IEEE 802.3ae-compliant XAUI. The device features a 16-bit OIF SPI-4.2 system interface for data transfer at up to 450 MHz DDR. Internal FIFOs are provisionable in 2 kB increments per port. It operates within an industrial temperature range of -40ºC to +85ºC using low power 0.18 micron CMOS technology.

Feature Summary

• Integrates ten triple-speed MACs with GbE SerDes and one 10 GbE MAC with XAUI
• Supports loss-less flow control and intelligent VLAN/MPLS identification
• Features configurable parallel or serial CPU interfaces and dual MIIM management ports
• Provides extensive loopback capabilities and statistical support for RMON and SNMP

Applications

• Enterprise and Metro Ethernet switches
• Multi-service provisioning platforms
• Metro SONET/SDH transport (ADMs)
• Edge and core aggregation routers
• DWDM transport terminals

Procurement Notes

Verify the specific package type and revision level against the manufacturer's current documentation before procurement. Confirm that the industrial temperature range (-40ºC to +85ºC) meets your operational requirements. Ensure compatibility with the required voltage levels (2.5V/3.3V IO) for your system design. Cross-reference the JTAG test port configuration if debugging infrastructure is utilized.

Selection Notes

Select this component when designing systems requiring high-density GbE and 10 GbE connectivity. It is suitable for OEMs needing seamless integration with network processors or ASICs via the SPI-4.2 interface. Consider its capability for frame-mapped Ethernet-over-SONET/SDH applications when paired with compatible mappers. Evaluate the integrated SerDes benefits for direct optical module connections.

Part Context

The VSC7323, also known as Meigs-IIe, is part of Vitesse Semiconductor's portfolio of high-performance networking solutions. It serves as a versatile building block for next-generation networks, focusing on enterprise, metro, and core applications. The chip enables cost-efficient per-port pricing through integrated SerDes technology.

Replacement Considerations

Consult Vitesse Semiconductor documentation for direct replacements or updated series components. Verify pinout and functional compatibility if substituting with newer generations of Ethernet MAC controllers.

FAQ

What types of interfaces does the VSC7323 support for triple-speed MAC ports?

The VSC7323 supports MII for 10/100 Ethernet, and RGMII or GMII for Gigabit Ethernet support.

How is the 10 GbE MAC interface implemented?

The 10 GbE MAC uses an integrated XAUI compliant serial interface, which is quad lane at 3.125 Gbps and supports programmable pre-emphasis and equalization.

Can the internal FIFOs be configured differently for each port?

Yes, the internal ingress and egress FIFOs are provisionable on a per-port basis in increments of 2 kB and can be set to cut-through or store-and-forward modes.