ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：IC MAC 10PORT GE W/SPI LEBGA
- Series：Meigs-IIe™
- Mfr：Microchip Technology
- Package：Tray
- Applications：Networking
- Multiplexer/Demultiplexer Circuit：-
- Switch Circuit：-
- Number of Channels：1
- On-State Resistance (Max)：-
- Voltage - Supply, Single (V+)：2.5V, 3.3V
- Voltage - Supply, Dual (V±)：-
- -3db Bandwidth：-
- Features：-
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：-
- Package / Case：728-BGA
- Supplier Device Package：728-TBGA (42.5x42.5)
- Grade：-
- Qualification：-
Download product information
Overview
The VSC7323 is a high-density Ethernet MAC chip featuring ten triple-speed MACs and one 10 GbE MAC. It integrates GbE SerDes for direct optical module connection and an OIF-compliant SPI-4.2 system interface. The device supports RGMII, GMII, and MII interfaces, with configurable parallel or serial CPU access. Built in low-power 0.18-micron CMOS technology, it operates within the industrial temperature range of -40ºC to +85ºC using 2.5V/3.3V IO.
Feature Summary
- Integrates ten triple-speed MACs with GbE SerDes and one IEEE 802.3ae-compliant 10 GbE MAC with XAUI.
- Provides an industry-standard OIF SPI-4.2 system interface for seamless packet data transfer.
- Supports intelligent VLAN/MPLS identification, loss-less flow control, and independent ingress/egress shaping.
- Includes dual MIIM interfaces for PHY management and extensive loopback capabilities.
Applications
- Enterprise and Metro Ethernet switches
- Multi-service provisioning platforms
- Metro SONET/SDH transport (ADMs)
- Edge and core aggregation routers
- DWDM transport terminals
Procurement Notes
Verify component authenticity through authorized distributors or original manufacturer channels. Confirm package integrity and pin alignment against the 728-pin TBGA specification. Ensure compatibility with required voltage levels and interface standards before integration into network infrastructure designs.
Selection Notes
Select this component for applications requiring high-density GbE and 10 GbE aggregation. Consider its integrated SerDes for simplified optical connectivity and SPI-4.2 interface for system-level integration. Evaluate thermal requirements against the specified industrial operating range during hardware design.
Part Context
Manufactured by Vitesse Semiconductor Corporation, now part of Microchip Technology. This product brief outlines specifications for the Meigs-IIe architecture, designed for next-generation network solutions requiring robust Ethernet aggregation and transport capabilities.
Replacement Considerations
Consult official Microchip documentation for current equivalent parts. Verify functional compatibility regarding MAC counts, interface types, and package dimensions before substitution.
FAQ
What interfaces does the VSC7323 support for GbE ports?
It supports RGMII, GMII, and MII interfaces for connecting to PHY devices.
How is the 10 GbE MAC connected?
It uses an integrated XAUI compliant serial interface for connection to 10 Gbps optical modules.
What is the maximum frame size supported?
It supports both minimum size 64B frames and up to 9600B jumbo frames.
