VSC8492YJD-13

VSC8492YJD-13

  • Description:IC TELECOM INTERFACE DUAL/QUAD
  • Series:-

SKU:30f167b3331d Category: Brand:

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Product Detailed Parameters

  • Description:IC TELECOM INTERFACE DUAL/QUAD
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tray
  • Function:Ethernet
  • Interface:Serial, SFI, XFI
  • Number of Circuits:2
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:484-BGA, FCBGA
  • Supplier Device Package:484-FCBGA (23x23)
  • Power (Watts):-
  • Grade:-
  • Qualification:-

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VSC8492YJD-13

Overview

The VSC8492YJD-13 is a dual-channel Universal 10G PHY with OTN/FEC and 1588v2/Y.1731 support, manufactured by Microchip Technology. It features two 10 Gbps bidirectional UPI client interfaces and two 10 Gbps bidirectional serial interfaces for direct connection to XFP or SFP+ optics modules or 10G serial backplanes. The device operates at data rates of 10 Gb/s using XFI/SFI interface types. It is housed in a 484-pin FCBGA package measuring 23 mm x 23 mm. Typical power dissipation is as low as 2.5 W per channel.

Feature Summary

  • Integrates Universal PHY Interface (UPI) supporting flexible mapping of 10 GbE LAN/WAN, 8G/10G Fibre Channel, OC-192/STM-64, and OTU2/1e/2e into G.709 OTN frames.
  • Includes integrated transponder support with redundant XFI/SFI SerDes/CDR ports enabling protection switching capabilities.
  • Provides direct connectivity to XFP and SFP+ optical modules via XFI/SFI interfaces with EDC, multitap Tx pre-emphasis, and adaptive DFE Rx.

Applications

  • N x 10G transponder/regenerator systems
  • Protected N x 10G muxponder/ROADM configurations
  • Ethernet or IP/MPLS switches/routers
  • MSPP/MSTP N x 10G line cards

Procurement Notes

Verify component authenticity through authorized channels due to the product's End-of-Life status. Confirm that the specific ordering suffix corresponds to the required package variant and manufacturing revision. Ensure compliance with humidity sensitivity handling requirements during storage and assembly processes.

Selection Notes

Select this component for designs requiring high integration of PHY, OTN wrapping, and FEC functions in a single chip. Consider the 484-pin FCBGA footprint and thermal management needs associated with the typical 2.5 W per channel dissipation when designing the PCB layout.

Part Context

This device belongs to the VSC8492 family of dual-channel universal 10G PHYs. It is designed to replace discrete solutions by combining PHY, MAC, PCS, OTN mapper, and FEC functions. The YJD suffix indicates the specific 484-pin FCBGA package configuration used for carrier-grade networking applications.

Replacement Considerations

VSC8492YJD-12

VSC8492YJD-13VSC8492YJD-13

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