VWM270-0075X2

Description：MOSFET 6N-CH 75V 270A V2-PAK
Series：-

SKU:998d7e53208d Category: FET, MOSFET Arrays Brand: IXYS

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Product introduction

Product Detailed Parameters

Description：MOSFET 6N-CH 75V 270A V2-PAK
Series：-
Mfr：IXYS
Package：Box
Technology：MOSFET (Metal Oxide)
Configuration：6 N-Channel (3-Phase Bridge)
FET Feature：-
Drain to Source Voltage (Vdss)：75V
Current - Continuous Drain (Id) @ 25°C：270A
Rds On (Max) @ Id, Vgs：2.1mOhm @ 100A, 10V
Vgs(th) (Max) @ Id：4V @ 500µA
Gate Charge (Qg) (Max) @ Vgs：360nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds：-
Power - Max：-
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：V2-PAK
Supplier Device Package：V2-PAK
Grade：-
Qualification：-

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VWM270-0075X2

Overview

The VWM270-0075X2 is a three-phase full bridge module utilizing IXYS Trench MOSFET technology. It integrates six N-channel elements within a single 17-pin package, designed for high-current applications. The device supports an operating junction temperature range of -40°C to 175°C and features low on-resistance with optimized intrinsic reverse diodes. This configuration provides a high level of integration for power conversion systems.

Feature Summary

Integrates six N-channel trench MOSFETs into a single three-phase full bridge configuration
Features low RDSon characteristics for efficient power handling
Includes optimized intrinsic reverse diodes for improved switching performance
Provides a high level of circuit integration within a compact 17-pin package

Applications

Three-phase motor drive inverters
AC/DC and DC/AC power converters
Industrial motor control systems

Procurement Notes

Verify the specific manufacturing date code and lot traceability upon receipt, as this component may be subject to lifecycle changes. Confirm that the physical package matches the 17-pin specification required for your PCB footprint. Ensure storage conditions maintain moisture sensitivity levels appropriate for surface mount assembly processes.

Selection Notes

Select this module when a complete three-phase bridge solution is required to minimize board space and assembly complexity. Consider the thermal management requirements associated with the 175°C maximum junction temperature. Evaluate the trade-off between the integrated design and potential repairability compared to discrete component solutions.

Part Context

This part belongs to IXYS' Trench MOSFET product family, which emphasizes low on-resistance and fast switching capabilities. The VWM270-0075X2 represents a specialized integration of these discrete technologies into a multi-element power module, targeting applications where high current density and phase symmetry are critical for system efficiency.