WP3161W1EFEI-320B1

Overview

The WP3161W1EFEI-320B1 is a network controller and processor IC from Microchip Technology's WinPath3 SL family. It features a 320 MHz operating speed and utilizes lead-free balls with Pb-free bumps for enhanced environmental compliance. The component is housed in an 896-ball FCBGA package, providing 672 lead connections for high-density interconnect applications. It supports I2C, RMII, and UART interfaces to facilitate communication and control. The device operates within a temperature range of -40°C to +85°C, ensuring reliability in industrial environments.

Feature Summary

• Integrates network controller and processor capabilities within a single integrated circuit
• Supports multiple communication interfaces including I2C, RMII, and UART
• Utilizes lead-free ball construction with Pb-free bump technology

Applications

• Industrial networking equipment requiring robust processor integration
• Communication systems utilizing RMII interface standards
• Embedded control applications operating in extended temperature ranges

Procurement Notes

Verify the specific ordering suffix and package configuration against official Microchip documentation to ensure compatibility with design requirements. Confirm that the lead-free ball and Pb-free bump specifications meet project environmental standards. Cross-reference the 896-ball FCBGA footprint with PCB layout guidelines to prevent assembly errors during procurement validation.

Selection Notes

Select this component when a combined network controller and processor solution is required for space-constrained designs. The 320 MHz speed and multi-interface support make it suitable for complex communication protocols. Ensure the 896-ball BGA package fits within the available board area and thermal constraints of the target application environment.

Part Context

This part belongs to the WinPath3 SL series, designed for high-performance networking applications. It integrates processing power with network control functions, reducing system complexity. The family offers various configurations to suit different interface and memory requirements while maintaining a consistent package form factor for design flexibility.

Replacement Considerations

Check for updated revisions within the same WinPath3 SL family that may offer improved performance or availability. Verify pin-to-pin compatibility if substituting with other variants in the series. Consult Microchip for any end-of-life notices or recommended alternative parts for long-term supply chain stability.