WP3161W6NHEI-400B1

Overview

The WP3161W6NHEI-400B1 is a network controller and processor IC from Microchip Technology's WinPath3 SLB family. It features a MIPS32 34Kc core processor with SRAM program memory. The device supports I2C, RMII, and UART interfaces for connectivity. It is housed in an 896-BGA surface mount package. The component operates within a temperature range of -40°C to +85°C.

Feature Summary

• Fast-paced network processor designed for low latency and high reliability applications
• Sophisticated multi-core communication engine with large internal program RAM for data path processing
• General-purpose MIPS 34K processor provides on-board control capabilities

Applications

• Industrial networking systems requiring robust connectivity
• Automotive communication modules
• Aerospace and defense avionics networks
• Edge computing infrastructure nodes

Procurement Notes

Verify the specific suffix B1 against the official datasheet to confirm pinout and electrical characteristics match the design requirements. Ensure the 896-BGA package footprint aligns with PCB layout constraints. Confirm RoHS compliance status through current manufacturer documentation before finalizing procurement decisions.

Selection Notes

Select this component when low latency and high reliability are critical for network processing tasks. The integrated MIPS32 core simplifies software development compared to discrete solutions. Consider the 896-BGA package size and thermal management requirements during the hardware design phase to ensure optimal performance under varying environmental conditions.

Part Context

This part belongs to the WinPath3 SLB series, which targets demanding communication environments. It integrates processing and networking functions into a single chip, reducing system complexity. The series is known for supporting diverse industrial protocols and offering scalable performance for complex network topologies.

Replacement Considerations

The WP3161D4NFEI-400B1 is a documented substitute within the same product family. Verify interface compatibility and package differences before substitution. Ensure that any replacement maintains the required operating temperature range and memory specifications for the target application.