X3DC07P1S

Overview

The X3DC07P1S is a Doherty Combiner manufactured by TTM Technologies, Inc. It operates within the 728 MHz to 768 MHz frequency range and utilizes a surface-mount device (SMD) package. The component is designed for high-performance applications in wireless systems.

Feature Summary

• Low profile design suitable for space-constrained layouts
• Manufacturing-friendly surface mount packaging
• High-performance signal combining capabilities

Applications

• Cellular base station transmitters
• Wireless communication infrastructure
• RF power amplifier modules

Procurement Notes

Verify the specific datasheet version when ordering, as manufacturing specifications may evolve. Confirm that the SMD footprint matches the target PCB design prior to integration. Ensure compliance with RoHS requirements if applicable to the final assembly standards. Cross-reference the manufacturer part number directly with official TTM documentation to avoid substitution errors during procurement.

Selection Notes

Select this component for designs requiring efficient power combining in the 728-768 MHz band. The low-profile form factor aids in reducing overall module height. Evaluate thermal management needs based on the expected power levels within the Doherty architecture. Ensure the RF layout supports the specific impedance matching required for optimal combiner performance.

Part Context

This component belongs to the X3 series of RF passive components from TTM Technologies. These parts are engineered for advanced computing and wireless markets. The series emphasizes reliability and compactness for modern electronic systems.

Replacement Considerations

No public confirmed substitute part numbers are available for this specific model.