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The X3DC09E2S is a Doherty combiner manufactured by TTM Technologies, Inc. It operates within the 920 MHz to 960 MHz frequency range and supports a power handling capacity of 200 W. The component utilizes Surface Mount Device (SMD) technology for integration into circuit boards.
Verify the specific datasheet version for the X3DC09E2S to confirm detailed electrical parameters such as insertion loss and isolation. Ensure that the PCB layout accommodates the thermal requirements associated with 200 W power handling. Confirm RoHS compliance status through official manufacturer documentation before finalizing procurement specifications.
Select this component when a Doherty combining topology is required for frequencies between 920 MHz and 960 MHz. The 200 W power rating dictates suitability for high-power applications. Verify that the SMD package dimensions align with the target board design constraints and that the operating temperature range meets system environmental requirements.
This part belongs to the Xinger III series of passive components produced by TTM Technologies. It functions specifically as an RF combiner rather than a standard coupler or filter. The designation indicates its role in synthesizing signals within Doherty amplifier configurations for wireless infrastructure.
The X3DC08E2S is a related Doherty combiner from the same manufacturer but operates in the 862 MHz to 894 MHz range. Substitution requires verification of frequency compatibility and power handling capabilities against the original design specifications.