X3DC19E2S

Overview

The X3DC19E2S is a Doherty combiner manufactured by TTM Technologies, Inc. Designed for surface-mount device (SMD) applications, this component operates within the frequency range of 1930 MHz to 1990 MHz. It supports a power handling capacity of 200 W and is classified under RF miscellaneous ICs and modules. The device is intended for general-purpose RF signal combining tasks in wireless communication systems.

Feature Summary

• Integrates Doherty architecture for efficient RF signal combining
• Optimized for SMD board mounting configurations
• Supports high-power operation up to 200 W
• Operates within the 1930-1990 MHz frequency band

Applications

• Wireless communication base stations
• RF signal processing circuits
• Doherty amplifier output stages

Procurement Notes

Verify the specific datasheet version and mechanical dimensions before integration. Confirm that the operating environment matches the specified frequency and power ratings. Ensure compatibility with the target PCB layout and thermal management requirements for reliable performance.

Selection Notes

Select this component when a compact, high-power Doherty combiner is required for the 1930-1990 MHz band. Consider its SMD form factor for automated assembly processes. Evaluate thermal dissipation needs given the 200 W power rating to ensure system stability.

Part Context

This part belongs to TTM Technologies' portfolio of RF components, specifically focusing on Doherty combiners. It serves as a critical element in modern RF front-end designs where signal combining efficiency and power handling are paramount for wireless infrastructure applications.

Replacement Considerations

Consult official TTM Technologies documentation for verified substitute part numbers. Cross-reference electrical parameters such as frequency range and power handling to ensure functional equivalence without compromising system integrity.