X66AK2H12AAAWA2

X66AK2H12AAAWA2

$374.16
  • Description:IC DSP ARM SOC BGA
  • Series:66AK2Hx KeyStone Multicore

SKU:39dff13fa926 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC DSP ARM SOC BGA
  • Series:66AK2Hx KeyStone Multicore
  • Mfr:Texas Instruments
  • Package:Tray
  • Type:DSP+ARM®
  • Interface:EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
  • Clock Rate:1.2GHz
  • Non-Volatile Memory:ROM (384kB)
  • On-Chip RAM:12.75MB
  • Voltage - I/O:0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
  • Voltage - Core:Variable
  • Operating Temperature:-40°C ~ 100°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:1517-BBGA, FCBGA
  • Supplier Device Package:1517-FCBGA (40x40)
  • Grade:-
  • Qualification:-

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X66AK2H12AAAWA2

Overview

The X66AK2H12AAAWA2 is a high-performance multicore digital signal processor and controller from Texas Instruments, belonging to the KeyStone II System-on-Chip family. It integrates four ARM Cortex-A15 cores and eight TMS320C66x DSP cores, providing a total of twelve processing units. The device supports clock frequencies up to 1.2 GHz for both core types. It utilizes an FCBGA-1517 package with surface-mount installation. The component operates within a temperature range of -40°C to +100°C and supports fixed/floating-point instruction sets. Power supply voltages include 950 mV for core logic and adjustable I/O voltages ranging from 850 mV to 3.3 V.

Feature Summary

  • Twelve-core architecture combining four ARM Cortex-A15 application processors and eight C66x DSPs
  • KeyStone II interconnect technology for efficient multi-core communication
  • Support for multiple interface protocols including Ethernet, PCIe, SPI, UART, USB, and I2C
  • FCBGA-1517 package suitable for high-density board designs

Applications

  • Video surveillance systems requiring real-time image processing
  • Industrial automation controllers
  • Medical imaging equipment
  • Test and measurement instrumentation

Procurement Notes

Verify the specific suffix 'AAAWA2' against official Texas Instruments documentation to confirm pinout, thermal characteristics, and electrical specifications. Ensure compatibility with the EVMK2H development environment if prototyping. Check for moisture sensitivity levels and reflow soldering profile requirements prior to assembly.

Selection Notes

Select this component when high-throughput parallel processing is required alongside general-purpose control tasks. Compare core counts and cache sizes against alternatives like the 66AK2H14 or 66AK2G series based on specific memory bandwidth needs. Confirm that the 1517-ball BGA footprint fits the target PCB layout constraints.

Part Context

This part is part of the 66AK2H12 series within the Texas Instruments KeyStone II ecosystem. It shares architectural similarities with other devices in the K2H family but offers a specific balance of ARM and DSP resources. It is distinct from the lower-core G-series or higher-core H-series variants.

Replacement Considerations

Direct functional substitutes within the same package may include other variants in the 66AK2H12 family, such as the 66AK2H12DAAWA2, provided pin-to-pin compatibility and software configuration are verified. Cross-family replacements require significant hardware redesign.

X66AK2H12AAAWA2X66AK2H12AAAWA2
$374.16
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