SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
XA7S50-1FGGA484I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 250 I/O 484FBGA. Review the specifications below when checking this part for your BOM.
The XA7S50-1FGGA484I is an industrial-grade Field Programmable Gate Array (FPGA) from the AMD/Xilinx Spartan-7 XA family. It utilizes a 28nm High Performance Low Power (HPL) process technology to deliver robust logic density and energy efficiency. The device features 52,160 Logic Cells, 8,150 Adaptive Logic Modules (ALMs), and 2,640 Kbits of embedded memory. It provides 250 user I/Os and operates within a temperature range of -40°C to +100°C. The component is housed in a 484-ball FCBGA package with a 1.0mm pitch, designed for high-reliability applications requiring extended lifecycle support.
Verify the specific suffix codes against official AMD documentation to confirm the exact speed grade, temperature rating, and packaging variant. Ensure that the procurement channel provides valid traceability records suitable for automotive or industrial certification requirements. Cross-reference the part number with current lifecycle status notices to confirm availability and long-term supply commitments.
Compare the XA7S50-1FGGA484I against the XC7S50 series if automotive qualification is not required, as the latter may offer different cost-performance ratios. Evaluate the available I/O count and transceiver bandwidth against system interface requirements. Consider the total power consumption profiles under varying load conditions to ensure thermal management solutions are adequate for the target enclosure design.
This component belongs to the Spartan-7 XA family, which extends the standard Spartan-7 capabilities with enhanced reliability features for harsh environments. It shares architectural similarities with the Artix-7 XA series but targets cost-sensitive applications requiring industrial durability. The 484-pin form factor allows for compact board designs while maintaining sufficient pin counts for peripheral connectivity.
XA7S50-1FGGA484Q
The XA7S50-1FGGA484I supports an industrial operating temperature range from -40°C to +100°C.
The device contains 52,160 Logic Cells and 8,150 Adaptive Logic Modules.
It uses a 484-ball Flip-Chip Ball Grid Array (FCBGA) package.
Explore related parts through Embedded, Integrated Circuits (ICs), all product categories, ChipApex homepage.