XAZU11EG-1FFVF1517I

Soc System On Chip Overview

The XAZU11EG-1FFVF1517I is an industrial-grade System-on-Chip FPGA from the AMD/Xilinx Zynq UltraScale+ MPSoC Enhanced Graphics (EG) family. It integrates a quad-core ARM Cortex-A53 Application Processing Unit, dual-core ARM Cortex-R5 Real-Time Processing Unit, and an ARM Mali-400 MP2 GPU with programmable logic. The device features up to 653K logic cells, 11 Mbit embedded memory, and 24 high-speed transceivers. Key specifications include a maximum APU frequency of 1.5 GHz, RPU frequency of 600 MHz, and GPU frequency of 667 MHz. It utilizes a 1517-ball FCBGA package and operates within a temperature range of -40°C to +100°C.

Soc System On Chip Feature Summary

• Heterogeneous multi-core architecture combining application processing, real-time control, and graphics acceleration
• High-performance programmable logic fabric with extensive embedded memory resources
• Integrated high-speed serial transceivers supporting complex communication protocols
• Industrial-grade reliability with extended temperature range support

Soc System On Chip Applications

• Industrial automation and control systems requiring deterministic real-time performance
• Advanced driver assistance systems (ADAS) and automotive infotainment
• Telecommunications infrastructure and baseband processing
• Medical imaging equipment and diagnostic devices

Soc System On Chip Procurement Notes

Verify the exact suffix 'I' confirms the industrial temperature grade (-40°C to +100°C). Confirm the 'XA' prefix indicates the specific enhanced graphics variant if required by design constraints. Cross-reference the package marking against the official datasheet to ensure authenticity. Check for RoHS compliance documentation as per regional regulations. Validate supply chain sources to avoid counterfeit components.

Soc System On Chip Selection Notes

Select this model when both high-level application processing and strict real-time control are necessary on a single die. The EG variant provides enhanced graphics capabilities compared to standard EV models. Ensure the 1517-pin footprint fits the PCB layout constraints. Verify that the available I/O count meets interface requirements. Consider thermal management solutions suitable for the specified operating temperature range.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG series, designed for applications demanding integrated processing, programmability, and graphics. It sits between lower-density EG models and higher-density variants like the XCZU11EG. The 'XAZU' designation typically refers to the broader product line or specific packaging/grade combinations within the AMD portfolio.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package may include other speed grades of the XCZU11EG series, such as XCZU11EG-2FFVF1517I, provided timing requirements are met. Upgrades to higher logic density parts like XCZU15EG require significant redesign. Downgrades to XCZU9EG may reduce resource availability.