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XAZU3EG-L1SFVA625I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A53 625FCBGA. Review the specifications below when checking this part for your BOM.
The AMD XAZU3EG-L1SFVA625I is a Zynq UltraScale+ MPSoC EG series system-on-chip designed for automotive applications. It integrates a quad-core ARM Cortex-A53 application processing unit operating up to 1.2 GHz and a dual-core ARM Cortex-R5 real-time processing unit running at 500 MHz. The programmable logic section provides over 154,000 logic cells. The device features 1.8 MB of on-chip RAM and supports interfaces including CANbus, I2C, SPI, UART/USART, and USB. It utilizes a 625-pin FCBGA package with dimensions of 21x21 mm and operates within a junction temperature range of -40°C to +100°C.
Verify the specific suffix 'L' against official AMD documentation to confirm its exact impact on binning or electrical characteristics relative to standard variants. Ensure compatibility with AEC-Q100 Grade 1 requirements if higher thermal margins are needed beyond the specified 100°C junction limit. Confirm RoHS3 compliance status through current manufacturer declarations prior to final procurement authorization.
Select this model when a balance of moderate FPGA capacity and robust automotive-grade processing is required. The EG series targets cost-sensitive automotive segments compared to EV counterparts. Evaluate the 154K logic cell count against design complexity to ensure sufficient resources for custom accelerators without excessive power consumption in constrained vehicle environments.
This component belongs to the XA Zynq UltraScale+ MPSoC family, which extends the standard Zynq architecture with automotive qualification. The 'XA' prefix denotes compliance with automotive reliability standards. The 'EG' suffix typically indicates entry-level performance within the UltraScale+ ecosystem, offering a specific trade-off between logic density and manufacturing yield suitable for volume automotive production.
Direct pin-compatible replacements within the same package include other XAZU3EG variants such as XAZU3EG-1SFVA625I or XAZU3EG-1SFVA625Q, provided temperature ranges align with system requirements. Cross-series migration to XAZU2EG or XAZU4EV requires schematic and firmware redesign due to differing resource counts and pin configurations.
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