Configuration PROMs For FPGAs XC17256EPDG8C product image

XC17256EPDG8C

  • Description:IC PROM SERIAL 256K 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube

SKU:a2c2483f505f Category: Brand:

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XC17256EPDG8C is listed in the Configuration PROMs For FPGAs range at ChipApex. The manufacturer field lists AMD. Its product description is IC PROM SERIAL 256K 8-DIP. Review the specifications below when checking this part for your BOM.

Configuration PROMs For FPGAs specifications for XC17256EPDG8C

  • Description:IC PROM SERIAL 256K 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube
  • Programmable Type:OTP
  • Memory Size:256Kb
  • Voltage - Supply:4.75V ~ 5.25V
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Supplier Device Package:8-PDIP

Configuration PROMs For FPGAs datasheet and documents for XC17256EPDG8C

XC17256EPDG8C

Configuration PROMs For FPGAs Overview

The AMD XC17256EPDG8C is a high-performance FPGA from the Virtex UltraScale+ family, designed for demanding data center and networking applications. It features integrated PCI Express Gen3x16 connectivity and supports advanced signal processing with up to 38 TOPs of DSP compute performance. The device utilizes 16 nm FinFET+ technology to deliver superior signal integrity and flexible interconnect options, enabling seamless migration to next-generation backplane and optics solutions while reducing system footprint.

Configuration PROMs For FPGAs Feature Summary

  • Integrates fast transceivers supporting up to 58 Gb/s PAM4 for multi-terabit systems
  • Provides enhanced continuous adaptive RX equalization and built-in KR-FEC for superior signal integrity
  • Includes an integrated block for PCI Express Gen3x16 in all devices

Configuration PROMs For FPGAs Applications

  • Data Center Interconnect
  • 5G Infrastructure
  • Networking Equipment
  • Test & Measurement Systems
  • Aerospace & Defense Applications

Configuration PROMs For FPGAs Procurement Notes

Verify the specific speed grade and package configuration against the official datasheet DS950 before procurement. Ensure compatibility with required thermal management solutions given the high-performance nature of the Virtex UltraScale+ series. Confirm that the selected variant meets the necessary environmental specifications for your intended deployment scenario.

Configuration PROMs For FPGAs Selection Notes

Select this component when requiring high-bandwidth interconnects and robust DSP capabilities within a hardware-programmable device. Consider the Virtex UltraScale+ 58G portfolio if your design demands doubling bandwidth on existing infrastructure or extending ASIC lifetimes through flexible programmability.

Configuration PROMs For FPGAs Part Context

This part belongs to the AMD Virtex UltraScale+ 58G FPGA family, which integrates 58 Gb/s PAM4 transceivers into the 16 nm portfolio. These devices are engineered to provide the fastest transceivers in a hardware-programmable device, timed with new optics availability to build future-proof systems for high-speed interconnects.

Configuration PROMs For FPGAs Replacement Considerations

Consult the official AMD migration guides for compatible upgrades within the Virtex UltraScale+ family. Verify pin-to-pin compatibility and resource availability when considering alternative models from the same series.

XC17256EPDG8CXC17256EPDG8C

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