Configuration PROMs For FPGAs XC17S10PD8I product image

XC17S10PD8I

$4.30
  • Description:IC PROM PROG I-TEMP 3.3V 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube

SKU:8444fc38b37a Category: Brand:

  
  • Quantity
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XC17S10PD8I is listed in the Configuration PROMs For FPGAs range at ChipApex. The manufacturer field lists AMD. Its product description is IC PROM PROG I-TEMP 3.3V 8-DIP. Review the specifications below when checking this part for your BOM.

Configuration PROMs For FPGAs specifications for XC17S10PD8I

  • Description:IC PROM PROG I-TEMP 3.3V 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube
  • Programmable Type:OTP
  • Memory Size:100kb
  • Voltage - Supply:4.5V ~ 5.5V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Supplier Device Package:8-PDIP

Configuration PROMs For FPGAs datasheet and documents for XC17S10PD8I

XC17S10PD8I

Configuration PROMs For FPGAs Overview

XC17S10PD8I is a specialty memory circuit manufactured by Rochester Electronics, distributed under the AMD umbrella. It features a synchronous memory interface with a density of 131,072 bits organized as 131,072 words by 1 bit. The device utilizes a plastic DIP-8 package and operates within a commercial temperature range of -40 °C to 85 °C.

Configuration PROMs For FPGAs Feature Summary

  • Synchronous memory operation for reliable data access
  • Single-bit wide memory organization
  • Plastic dual in-line package construction

Configuration PROMs For FPGAs Applications

  • Specialty memory storage applications
  • Industrial embedded systems requiring DIP packaging
  • Commercial electronic equipment

Configuration PROMs For FPGAs Procurement Notes

Verify the manufacturer designation carefully, as this component is produced by Rochester Electronics rather than AMD directly. Confirm the specific suffix 'PD8I' corresponds to the plastic DIP-8 package and industrial temperature rating. Ensure compatibility with existing board layouts designed for standard DIP-8 footprints before procurement.

Configuration PROMs For FPGAs Selection Notes

Select this part when a synchronous 1-bit wide memory solution in a through-hole DIP-8 package is required. It serves as a direct replacement for legacy designs needing 131 Kbit capacity. Consider the -40 °C to 85 °C operating range for suitability in commercial or light industrial environments where surface-mount options are not feasible.

Configuration PROMs For FPGAs Part Context

This component belongs to the family of specialty memory circuits offered by Rochester Electronics. These parts are typically used to support legacy systems or specialized hardware that requires robust, through-hole memory components. The product line emphasizes reliability and long-term availability for critical electronic applications.

Configuration PROMs For FPGAs Replacement Considerations

Direct substitutes include XC17S20PD8I for higher density needs in the same package. Verify pinout compatibility if replacing from other manufacturers' synchronous SRAMs in DIP-8 form factors.

XC17S10PD8IXC17S10PD8I
$4.30
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