XC17S10XLPDG8C

XC17S10XLPDG8C

$2.75
  • Description:IC PROM PROG C-TEMP 3.3V 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube

SKU:8e754b83f183 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC PROM PROG C-TEMP 3.3V 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube
  • Programmable Type:OTP
  • Memory Size:100kb
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Supplier Device Package:8-PDIP

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XC17S10XLPDG8C

Overview

XC17S10XLPDG8C is a programmable read-only memory device manufactured by AMD, designed for configuring Xilinx Field Programmable Gate Arrays. It features a storage capacity of 128 kilobits and operates on a single 5V power supply. The component utilizes One-Time Programmable technology to store configuration data permanently. It is housed in an 8-lead Small Outline Package with a narrow body width of 3.90mm. The device supports industrial temperature ranges from -40°C to +85°C, ensuring reliable operation in demanding environments.

Feature Summary

  • Provides non-volatile storage for FPGA configuration bitstreams
  • Supports high-speed serial programming interface
  • Designed for low voltage 5V operation
  • Industrial temperature range capability

Applications

  • Configuration of Xilinx Spartan-II and Spartan-IIE FPGAs
  • Industrial control systems requiring robust FPGA initialization
  • Telecommunications equipment needing reliable startup sequences
  • Automotive embedded applications with strict environmental standards

Procurement Notes

Verify the specific suffix 'DG8C' against official AMD documentation to confirm package type and temperature grade. Ensure compatibility with target FPGA family before procurement. Check for end-of-life status or alternative recommendations from the manufacturer. Confirm RoHS compliance requirements for your specific application environment.

Selection Notes

Select this component when configuring Xilinx FPGAs requiring 128K-bit capacity. Consider the SOP-8 package constraints for PCB layout. Evaluate thermal management needs for industrial temperature ranges. Compare against newer generation PROM devices if long-term availability is critical for the product lifecycle.

Part Context

This part belongs to the XC17S series of configuration PROMs developed by AMD (formerly Xilinx). These devices are specifically engineered to initialize Xilinx Spartan architecture FPGAs. The series offers various capacities and packages to suit different design complexity and space requirements. They serve as the primary source of configuration data upon power-up.

Replacement Considerations

Check AMD's official obsolescence notices for direct replacements. Verify pin-to-pin compatibility with existing board layouts. Ensure the replacement device supports the same FPGA configuration protocol. Consult distributor databases for current availability of equivalent components.

XC17S10XLPDG8CXC17S10XLPDG8C
$2.75
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