XC17S10XLVO8I

Overview

The AMD XC17S10XLVO8I is a specialty memory circuit manufactured by Rochester Electronics, functioning as a non-volatile configuration device for Xilinx FPGAs. It utilizes the XC17S10 architecture to store FPGA configuration data. The component is housed in an 8-pin Plastic Dual In-line Package (PDIP-8). It operates with a synchronous interface and features a memory density of 178,144 bits organized as 178,144 words by 1 bit width. The device supports a single function number and includes eight terminals. It is rated for operation within a temperature range of -40 °C to +85 °C.

Feature Summary

• Provides hardware-based storage for FPGA configuration data
• Supports synchronous operation modes for reliable data transfer
• Designed for industrial temperature environments

Applications

• Configuration storage for Xilinx Spartan-3E FPGAs
• Industrial control systems requiring robust FPGA boot data
• Embedded applications needing secure configuration retention

Procurement Notes

Verify the specific suffix codes against the manufacturer's current datasheet to ensure compatibility with your target FPGA family. Confirm that the PDIP-8 package meets your board layout requirements. Check for RoHS compliance status if required by your manufacturing standards. Ensure the source is authorized to prevent counterfeit components. Validate the operating temperature range matches your environmental specifications.

Selection Notes

Select this component when configuring Xilinx Spartan-3E devices. Compare pinout compatibility with existing designs. Consider the PDIP-8 package constraints for assembly methods. Evaluate the 178,144-bit capacity against your design's configuration size needs. Verify voltage levels match the target FPGA's configuration interface requirements.

Part Context

This part belongs to the Xilinx XC17 series of configuration PROMs, now managed by AMD after its acquisition of Xilinx. These devices are essential for storing the bitstream data that programs the FPGA fabric upon power-up. The XC17S10 variant offers a specific density suitable for mid-range Spartan-3E designs. Rochester Electronics continues production of legacy parts for long-term supply chain stability.

Replacement Considerations

Check for direct cross-references from Xilinx or AMD documentation. Verify pin-to-pin compatibility with alternative configuration devices. Ensure the replacement supports the same synchronous protocol. Confirm package dimensions match the PCB footprint.