XC17S200APDG8I

Overview

The XC17S200APDG8I is a serial PROM device manufactured by AMD (formerly Xilinx), designed for FPGA configuration applications. It features a storage capacity of 2 Mbit and operates within a supply voltage range of 3 V to 3.6 V. The component utilizes One-Time Programmable (OTP) technology, ensuring permanent data retention once programmed. It is housed in an 8-pin DIP package with a standard 0.300-inch (7.62 mm) width, suitable for through-hole mounting. The device supports industrial temperature ranges from -40°C to +85°C, providing reliable performance in demanding environments.

Feature Summary

• Serial PROM architecture optimized for configuring Xilinx FPGAs
• One-time programmable memory structure for secure configuration data storage
• Industrial temperature rating for robust environmental operation
• Through-hole 8-pin DIP packaging for standard board integration

Applications

• Configuration of Xilinx Spartan-3E and Spartan-6 FPGAs
• System boot initialization for embedded designs
• Secure storage of FPGA bitstream data

Procurement Notes

Verify the specific suffix 'PDG8I' against official AMD documentation to confirm package type and temperature grade. Confirm end-of-life status as this series may be discontinued. Ensure programming equipment compatibility with OTP serial PROMs before procurement. Check for authorized distributors to avoid counterfeit components.

Selection Notes

Select this component when a non-volatile, one-time programmable solution is required for FPGA configuration. Consider the 2 Mbit capacity limits for large bitstreams. Evaluate the DIP package constraints against PCB layout requirements. Compare against newer serial NOR flash options if reprogrammability is needed.

Part Context

This part belongs to the XC17S200A family of serial PROMs from AMD/Xilinx. These devices are specifically engineered to store configuration data for Xilinx Spartan and Virtex FPGA families. They provide a cost-effective method for initializing FPGA logic upon power-up without requiring external microcontrollers.

Replacement Considerations

Check AMD's official obsolescence notices for direct replacements. Verify pinout compatibility with existing PCB layouts. Ensure new components support the same voltage and interface protocols.