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The AMD XC17S30PD8C is a one-time programmable (OTP) configuration PROM designed for configuring Field Programmable Gate Arrays (FPGAs). It provides 300 kilobits of non-volatile storage capacity to hold FPGA bitstream data. The device is housed in an 8-pin Dual In-line Package (DIP) with a standard 0.300-inch (7.62mm) width, facilitating through-hole mounting on printed circuit boards.
Verify the component is genuine AMD or authorized equivalent. Confirm the package matches the 8-DIP specification. Ensure the OTP nature aligns with design requirements, as data cannot be reprogrammed after initial writing. Check for any specific ordering suffixes that may indicate temperature range or packaging variations.
Select this component when a fixed, non-volatile configuration source is required for an FPGA. Consider the 300kb capacity limit against the target FPGA's bitstream size. Evaluate the DIP package suitability for the assembly process compared to surface-mount alternatives like SOIC or PLCC if space constraints exist.
This part belongs to the AMD/Xilinx XC17 series of configuration PROMs. These devices are specifically engineered to store the configuration data necessary to initialize various Xilinx FPGA families. They serve as a reliable alternative to flash memory or SRAM-based configuration methods in systems requiring persistent startup states.
The XC17S20PD8C is a documented substitute within the same family, offering similar functionality but with reduced storage capacity. Verify that the smaller capacity of the XC17S20PD8C is sufficient for the intended FPGA configuration before substitution.