XC17S30XLVO8I

XC17S30XLVO8I

$5.93
  • Description:IC 3V PROM SER 300K 8-SOIC
  • Series:-
  • Mfr:AMD
  • Package:Tube

SKU:ac272fe1f901 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC 3V PROM SER 300K 8-SOIC
  • Series:-
  • Mfr:AMD
  • Package:Tube
  • Programmable Type:OTP
  • Memory Size:300kb
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-TSOP

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XC17S30XLVO8I

Overview

The AMD XC17S30XLVO8I is a specialty memory circuit component manufactured by Rochester Electronics. It is housed in an 8-pin Plastic Dual In-line Package (PDIP-8). The device features a memory density of 262,144 bits with a width of 1 bit, organized as 262,144 words. It operates synchronously and supports a temperature range from -40 °C to 85 °C.

Feature Summary

  • Provides synchronous operation for specialty memory applications
  • Utilizes a standard PDIP-8 plastic package for through-hole mounting
  • Designed for industrial temperature environments

Applications

  • Industrial control systems requiring non-volatile or specialized memory storage
  • Embedded hardware designs utilizing legacy or specific memory architectures
  • Replacement components for existing electronic assemblies

Procurement Notes

Verify the manufacturer designation carefully, as this part is produced by Rochester Electronics, a subsidiary specializing in obsolete and hard-to-find semiconductors. Confirm that the PDIP-8 package and synchronous interface match your system requirements. Ensure the operating temperature range meets your environmental specifications before procurement.

Selection Notes

Select this component when a specific 262,144-bit synchronous memory circuit in an 8-pin DIP package is required. It serves as a direct replacement for older AMD memory parts. Consider the industrial temperature rating if the application involves variable environmental conditions. Verify pin compatibility with existing PCB footprints.

Part Context

This component belongs to the XC17 series of specialty memory circuits originally developed by AMD. These devices are now managed by Rochester Electronics, which focuses on sustaining production for legacy semiconductor products. The series includes various densities and package options tailored for specific embedded and industrial memory needs.

Replacement Considerations

Consult the XC17S30LVC datasheet for potential functional equivalents. Verify pinout and electrical characteristics against other XC17 series variants to ensure compatibility.

XC17S30XLVO8IXC17S30XLVO8I
$5.93
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