XC17S50APDG8C

XC17S50APDG8C

  • Description:IC PROM SER 50K C-TEMP 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube

SKU:a39e890af99f Category: Brand:

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Product Detailed Parameters

  • Description:IC PROM SER 50K C-TEMP 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube
  • Programmable Type:OTP
  • Memory Size:500kb
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Supplier Device Package:8-PDIP

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XC17S50APDG8C

Overview

The AMD XC17S50APDG8C is a high-performance FPGA from the Virtex UltraScale+ family, designed for demanding data center and networking applications. It features advanced transceivers capable of 58 Gb/s PAM4 signaling, enabling multi-terabit system throughput. The device integrates up to 38 TOPs of DSP compute performance through 22 TeraMACs, supporting complex signal processing tasks. Built on a 16 nm FinFET+ process, it offers superior signal integrity with enhanced continuous adaptive RX equalization and built-in KR-FEC. The architecture supports PCIe Gen3x16 and select devices include PCIe Gen4x8 with CCIX support, facilitating efficient interconnects.

Feature Summary

  • Integrates 58 Gb/s PAM4 transceivers for doubling bandwidth on existing infrastructure
  • Provides up to 38 TOPs of DSP compute performance via 22 TeraMACs
  • Supports flexible connectivity including 28G/58G backplanes and chip-to-optics interfaces
  • Features integrated PCI Express blocks with CCIX support in select configurations

Applications

  • Data Center Interconnect systems requiring high-speed optical interfaces
  • 5G infrastructure equipment utilizing next-generation backplane technologies
  • Test & Measurement instruments needing precise signal processing capabilities
  • Aerospace & Defense applications demanding robust, programmable hardware solutions

Procurement Notes

Verify the specific suffix and package type against official AMD documentation to ensure compatibility with your board design. Confirm lead times and availability directly with authorized distributors as these vary by region. Ensure that your development environment supports the required Vitis tools for programming this UltraScale+ device. Check for any specific environmental or reliability certifications required for your deployment scenario.

Selection Notes

Select this component when high-density transceiver counts and significant DSP resources are necessary for protocol conversion or signal conditioning. It is suitable for migrating legacy ASIC designs to reconfigurable platforms without sacrificing performance. Consider the power consumption and thermal requirements associated with 58G PAM4 operation. Evaluate if the integrated PCIe and CCIX capabilities meet your system's I/O bandwidth needs compared to lower-tier UltraScale+ models.

Part Context

This part belongs to the AMD Virtex UltraScale+ 58G FPGA portfolio, which represents a high-end segment of Xilinx's programmable logic offerings. These devices are engineered to extend ASIC lifetimes by providing hardware programmability at speeds previously unavailable in FPGAs. The family targets markets requiring seamless migration to next-gen optics and high-performance interconnects while maintaining low latency and high throughput.

Replacement Considerations

Direct replacements within the same family may include other Virtex UltraScale+ variants with similar transceiver counts but potentially different DSP or memory resources. Cross-referencing pin-to-pin compatibility is essential when moving between different die sizes or package options within the UltraScale+ ecosystem. Verify software toolchain compatibility if upgrading from older Virtex-7 or Kintex UltraScale+ devices.

XC17S50APDG8CXC17S50APDG8C

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