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XC3S2000-4FG676C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 489 I/O 676FCBGA. Review the specifications below when checking this part for your BOM.
The XC3S2000-4FG676C is a Field Programmable Gate Array (FPGA) belonging to the Spartan-3 family, manufactured by AMD. It features 5 million logic gates and 8320 Logic Blocks/CLBs, supporting up to 489 I/Os within a 676-ball FineLine BGA package measuring 27x27 mm. The device operates with a supply voltage range of 1.14V to 1.26V and supports a total RAM capacity of 1,916,928 bits. It includes 74,880 logic elements/units and functions within a junction temperature range of 0°C to 85°C.
This component is officially discontinued and no longer in production. Verification of availability should focus on surplus or secondary market sources rather than direct manufacturer distribution. Ensure that any sourced units are genuine and match the specific package and speed grade requirements for your design.
Designers requiring new implementations should consider modern alternatives from the Xilinx portfolio, such as the Artix or Kintex families, which offer improved performance per watt and updated toolchain support. The XC3S2000 series lacks advanced high-speed serial transceivers found in newer generations, making it suitable primarily for parallel logic and moderate-speed interface applications.
The Spartan-3 family represents an earlier generation of FPGA technology from Xilinx, now under AMD. This specific model sits within the mid-range density tier of that lineup, designed to balance cost and performance for volume applications. It serves as a foundational component for legacy systems and educational platforms where established design flows are already implemented.
Public confirmed substitute part numbers include LFE5U-85F-6BG756C from Lattice Semiconductor and T55F576C3 from Efinix. These devices offer comparable functionality but require verification of pin compatibility and resource mapping during migration.
The specified operating junction temperature range is 0°C to 85°C.
Yes, the Spartan-3 family architecture supports DDR3 memory interfaces as part of its standard feature set.
The device is housed in a 676-FineLine BGA package with dimensions of 27x27 mm.
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