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The XC56309AG100AR2 is a fixed-point Digital Signal Processor (DSP) from the NXP DSP563xx series. It operates at a clock rate of 100MHz and features 24-bit processing capability. The device integrates 24kB of on-chip RAM and 576B of non-volatile ROM. It utilizes a 196-LBGA package with dimensions of 15x15 mm. The core and I/O voltages are specified at 3.30V, and it supports an operating temperature range of -40°C to 105°C (TJ). Interfaces include Host Interface, SSI, and SCI.
Verify component authenticity through authorized NXP distributors. Confirm RoHS compliance status as documentation indicates non-compliance. Check for obsolescence status prior to procurement planning. Ensure ESD handling procedures are followed due to LBGA packaging sensitivity.
Select this model for applications requiring 24-bit fixed-point DSP performance at 100MHz. Ensure design compatibility with 3.3V core and I/O voltage levels. Verify that the 196-LBGA footprint fits the target PCB layout. Consider thermal management for operation up to 105°C junction temperature.
This part belongs to the NXP DSP563xx family, designed for embedded digital signal processing. It complements other NXP microcontrollers and processors by providing specialized high-throughput mathematical operations suitable for real-time control and signal filtering tasks in industrial environments.
Check NXP official documentation for direct pin-to-pin replacements within the DSP563xx series. Verify electrical parameter compatibility if substituting with similar fixed-point DSPs.