XC56309AG100AR2

XC56309AG100AR2

$35.33
  • Description:IC DSP 24BIT 100MHZ 144-LQFP
  • Series:DSP563xx

SKU:aec0d74f9cff Category: Brand:

  
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Product Detailed Parameters

  • Description:IC DSP 24BIT 100MHZ 144-LQFP
  • Series:DSP563xx
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Type:Fixed Point
  • Interface:Host Interface, SSI, SCI
  • Clock Rate:100MHz
  • Non-Volatile Memory:ROM (576B)
  • On-Chip RAM:24kB
  • Voltage - I/O:3.30V
  • Voltage - Core:3.30V
  • Operating Temperature:-40°C ~ 105°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:144-LQFP
  • Supplier Device Package:144-LQFP (20x20)
  • Grade:-
  • Qualification:-

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XC56309AG100AR2

Overview

The XC56309AG100AR2 is a fixed-point Digital Signal Processor (DSP) from the NXP DSP563xx series. It operates at a clock rate of 100MHz and features 24-bit processing capability. The device integrates 24kB of on-chip RAM and 576B of non-volatile ROM. It utilizes a 196-LBGA package with dimensions of 15x15 mm. The core and I/O voltages are specified at 3.30V, and it supports an operating temperature range of -40°C to 105°C (TJ). Interfaces include Host Interface, SSI, and SCI.

Feature Summary

  • Fixed-point DSP architecture with 24-bit data path
  • 100MHz clock rate for high-speed signal processing
  • Integrated 24kB RAM and 576B ROM
  • 196-LBGA (15x15) surface mount packaging

Applications

  • Digital signal processing tasks requiring fixed-point arithmetic
  • Industrial control systems utilizing SSI or SCI interfaces
  • Embedded audio or vibration analysis applications

Procurement Notes

Verify component authenticity through authorized NXP distributors. Confirm RoHS compliance status as documentation indicates non-compliance. Check for obsolescence status prior to procurement planning. Ensure ESD handling procedures are followed due to LBGA packaging sensitivity.

Selection Notes

Select this model for applications requiring 24-bit fixed-point DSP performance at 100MHz. Ensure design compatibility with 3.3V core and I/O voltage levels. Verify that the 196-LBGA footprint fits the target PCB layout. Consider thermal management for operation up to 105°C junction temperature.

Part Context

This part belongs to the NXP DSP563xx family, designed for embedded digital signal processing. It complements other NXP microcontrollers and processors by providing specialized high-throughput mathematical operations suitable for real-time control and signal filtering tasks in industrial environments.

Replacement Considerations

Check NXP official documentation for direct pin-to-pin replacements within the DSP563xx series. Verify electrical parameter compatibility if substituting with similar fixed-point DSPs.

XC56309AG100AR2XC56309AG100AR2
$35.33
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