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XC6SLX75-3FGG676C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 408 I/O 676FBGA. Review the specifications below when checking this part for your BOM.
The XC6SLX75-3FGG676C is a Spartan-6 LX Field Programmable Gate Array manufactured by AMD. It features 74,637 logic elements and 11,662 Adaptive Logic Modules within a 676-pin FBGA package. The device includes 3.02 Mbit of embedded memory, comprising 692 kbit distributed RAM and 3,096 kbit embedded block RAM. It supports up to 408 I/O pins and operates at a maximum frequency of 1.08 GHz. The core voltage ranges from 1.14 V to 1.26 V, with an operating temperature range of 0°C to +85°C.
Verify the specific suffix codes against official AMD documentation to confirm speed grade and temperature rating. Ensure the package type matches the target PCB footprint requirements. Confirm RoHS compliance status through current manufacturer declarations before finalizing procurement orders.
Select this model when high logic capacity is required within a standard FBGA form factor. Compare resource utilization against the XC6SLX100T if additional transceivers are needed. Verify that the 1.2V core voltage aligns with the system power supply design constraints.
This component belongs to the Spartan-6 LX family, designed for cost-sensitive applications requiring significant programmable logic. It serves as a mid-range solution within the broader Xilinx FPGA portfolio, bridging lower-density devices and higher-end Virtex or Kintex series products.
Direct pin-compatible replacements are limited due to architectural differences. Consider the XC6SLX75T-3FGG676I for industrial temperature ranges or the XC7S75-1FGGA676C for next-generation architecture migration, noting potential design re-verification.
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