Field Programmable Gate Array XC6SLX75-3FGG676I product image

XC6SLX75-3FGG676I

$222.11
  • Description:IC FPGA 408 I/O 676FBGA
  • Series:Spartan®-6 LX

SKU:f3fdec4a536f Category: Brand:

  
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XC6SLX75-3FGG676I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 408 I/O 676FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XC6SLX75-3FGG676I

  • Description:IC FPGA 408 I/O 676FBGA
  • Series:Spartan®-6 LX
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:5831
  • Number of Logic Elements/Cells:74637
  • Total RAM Bits:3170304
  • Number of I/O:408
  • Voltage - Supply:1.14V ~ 1.26V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:676-BGA
  • Supplier Device Package:676-FBGA (27x27)
  • Number of Gates:-

Field Programmable Gate Array datasheet and documents for XC6SLX75-3FGG676I

XC6SLX75-3FGG676I

Field Programmable Gate Array Overview

The XC6SLX75-3FGG676I is a Spartan-6 LX Field Programmable Gate Array manufactured by AMD. It features 74,637 logic elements and 11,662 Adaptive Logic Modules within a 676-pin FBGA package. The device includes 3.02 Mbit of embedded memory, comprising distributed RAM and embedded block RAM. It supports up to 408 I/O pins and operates with a core voltage range of 1.14 V to 1.26 V. The industrial temperature variant functions between -40°C and +100°C, with a maximum operating frequency of 1.08 GHz.

Field Programmable Gate Array Feature Summary

  • High-density programmable logic architecture optimized for complex digital designs
  • Integrated soft-core MicroBlaze processor capability for system-level integration
  • Support for multiple high-speed I/O standards and protocols
  • Industrial temperature rating for reliable operation in demanding environments

Field Programmable Gate Array Applications

  • Advanced bridge applications in automotive infotainment systems
  • Industrial automation control modules
  • Consumer product logic interfacing
  • Network infrastructure components

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature range (-40°C to +100°C) distinct from commercial variants. Confirm the speed grade '3' matches required timing constraints. Ensure the FBGA-676 footprint aligns with PCB design specifications. Check RoHS compliance status through official manufacturer documentation prior to procurement.

Field Programmable Gate Array Selection Notes

Select this model when 74,637 logic resources are required within a 676-pin form factor. Choose the industrial grade variant if ambient temperatures exceed standard commercial limits. Verify that the 1.08 GHz performance meets signal processing requirements. Consider power consumption profiles relative to the 1.2V core voltage specification during thermal design.

Field Programmable Gate Array Part Context

This component belongs to the AMD Spartan-6 LX family, designed for cost-sensitive yet high-performance applications. It sits between lower-density models like the XC6SLX45 and higher-capacity devices such as the XC6SLX100. The series emphasizes high logic-to-pin ratios and integrated connectivity features for embedded systems.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements within the same package are limited due to specific speed grades. Cross-family migration to Artix-7 requires retargeting and potential redesign. Consult AMD documentation for verified equivalent part numbers offering identical electrical and mechanical characteristics.

XC6SLX75-3FGG676IXC6SLX75-3FGG676I
$222.11
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