Soc System On Chip XC7Z010-3CLG225E product image

XC7Z010-3CLG225E

$92.52
  • Description:IC SOC CORTEX-A9 866MHZ 225BGA
  • Series:Zynq®-7000

SKU:9bc8018afcb4 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

XC7Z010-3CLG225E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A9 866MHZ 225BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XC7Z010-3CLG225E

  • Description:IC SOC CORTEX-A9 866MHZ 225BGA
  • Series:Zynq®-7000
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:866MHz
  • Primary Attributes:Artix™-7 FPGA, 28K Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:225-LFBGA, CSPBGA
  • Supplier Device Package:225-CSPBGA (13x13)

Soc System On Chip datasheet and documents for XC7Z010-3CLG225E

XC7Z010-3CLG225E

Soc System On Chip Overview

The XC7Z010-3CLG225E is a Zynq-7000 SoC FPGA from AMD Xilinx, integrating dual-core ARM Cortex-A9 MPCore processing system (PS) with Artix-7 programmable logic (PL). Manufactured on 28nm HPL technology, the PS operates at a maximum frequency of 667 MHz in the -3 speed grade. The device features 32 KB instruction and data caches per core, 512 KB L2 cache, and 256 KB on-chip memory. The PL section provides approximately 28K logic cells, 44K flip-flops, 4.9 Mb block RAM, and 220 DSP slices. It includes an XADC module with two 12-bit ADCs supporting up to 1 MSPS sampling rate for mixed-signal monitoring.

Soc System On Chip Feature Summary

  • Heterogeneous architecture combining software-programmable ARM processors with hardware-programmable FPGA fabric
  • Integrated AXI interconnect enabling low-latency communication between processing system and programmable logic
  • On-chip mixed-signal capabilities via XADC for real-time voltage and temperature monitoring
  • Support for partial reconfiguration allowing dynamic updates to specific logic regions without full system restart

Soc System On Chip Applications

  • Industrial control systems requiring deterministic real-time processing
  • Medical imaging devices needing flexible signal acquisition and processing
  • Automotive infotainment and instrument cluster prototypes
  • Test and measurement equipment requiring custom protocol handling

Soc System On Chip Procurement Notes

Verify the exact speed grade suffix '3' against the target design timing requirements, as it differs from the more common '-2' grade. Confirm the package type CLG225 matches the PCB footprint constraints. Ensure the industrial or commercial temperature range aligns with the final deployment environment specifications before ordering.

Soc System On Chip Selection Notes

Select this model when the application requires moderate FPGA resources combined with ARM processing power but does not need the higher performance of the Z-7030 or Z-7045 series. The -3 speed grade offers a cost-effective solution for designs where the 667 MHz processor clock is sufficient. Compare resource utilization against the 28K logic cell limit to ensure the design fits within the Artix-7 PL capacity.

Soc System On Chip Part Context

This component belongs to the Zynq-7000 family, specifically the Z-7010 tier, which sits below the Z-7020 and Z-7035 models in terms of programmable logic density. It shares the same Processing System architecture as larger variants but with reduced PL resources. The CLG225 package is a smaller form-factor option compared to the CLG400 or FBG676 packages found in higher-end models.

Soc System On Chip Replacement Considerations

Direct functional replacements within the same package include XC7Z010-2CLG225E for lower speed requirements or XC7Z010-3CLG225I for industrial temperature ranges. For pin-compatible upgrades with more resources, consider the XC7Z020-2CLG225I, though verification of timing closure is required due to potential differences in internal routing.

XC7Z010-3CLG225EXC7Z010-3CLG225E
$92.52
Buy Now