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The XC95288XV-6FG256C is a high-density Complex Programmable Logic Device (CPLD) from AMD's Xilinx XC9500 family, manufactured using CMOS Flash memory technology. It features 28,800 usable system gates and supports up to 320 macrocells within a single package. The device operates with a maximum propagation delay of 6 nanoseconds in the -6 speed grade and utilizes a 256-pin FineLine BGA package. Key electrical characteristics include a supply voltage range of 2.7V to 3.6V for VCCINT and support for both JTAG and ISP programming via its embedded Flash architecture, eliminating the need for external configuration devices.
Verify the specific suffix 'XV' indicates the extended temperature range variant (-40°C to +85°C) and 'FG256' confirms the FineLine BGA package type. Ensure the ordering part number matches the required speed grade '-6' for 6ns timing specifications. Confirm RoHS compliance status if restricted substances are a constraint for the target assembly process.
Select this component when a non-volatile CPLD solution is required to reduce bill-of-materials count by integrating configuration storage. Compare against the standard XC95288XL series if lower cost is prioritized over the extended temperature range or specific packaging constraints. Evaluate pin count requirements carefully as the 256-pin BGA offers limited I/O availability relative to the total pin count due to power and ground connections.
This device belongs to the XC9500 family, which was designed to replace EEPROM-based CPLDs by offering faster reprogramming speeds and higher endurance. It serves as a bridge between low-density PLDs and high-density FPGAs, providing a cost-effective solution for moderate logic complexity where non-volatility and ease of use are critical design factors.
Direct pin-to-pin replacements within the same family include the XC95288XV-6FG256I for industrial temperature ranges or different speed grades such as XC95288XV-5FG256C for slower timing requirements. Cross-family migration to the XC9500XL series may require schematic adjustments due to differences in I/O bank configurations and power management features.