XCF08PVO48C

Overview

The XCF08PVO48C is a non-volatile configuration PROM manufactured by AMD, designed for system-in-programmable (SIP) use with Field Programmable Gate Arrays. It features an 8Mb storage capacity and operates within a voltage range of 1.65V to 2.0V. The device is housed in a 48-pin Thin Shrink Small Outline Package (TFSOP) with a width of 18.40mm. It supports industrial operating temperatures from -40°C to +85°C and complies with RoHS3 standards.

Feature Summary

• System-in-programmable capability allows for flexible FPGA configuration updates without removal from the circuit board.
• Non-volatile memory architecture retains configuration data without continuous power supply.
• Industrial temperature rating ensures reliable operation in demanding environmental conditions.

Applications

• Configuration of Xilinx Field Programmable Gate Arrays
• Embedded systems requiring persistent boot code storage
• Industrial control hardware

Procurement Notes

Verify component authenticity through authorized distributors or original equipment manufacturers. Confirm package integrity and pin alignment prior to installation. Ensure compatibility with target FPGA configuration interfaces. Check for end-of-life status or alternative sourcing requirements due to potential discontinuation.

Selection Notes

Select this component when an 8Mb configuration capacity is required for compatible Xilinx devices. Verify that the design accommodates the 1.65V to 2.0V supply voltage range. Ensure the PCB layout supports the 48-TFSOP footprint dimensions. Consider thermal management requirements for the specified industrial temperature range.

Part Context

This part belongs to the XCFxx(P,V) Platform Flash PROM family, which provides non-volatile storage for FPGA configuration data. These devices are engineered to interface directly with Xilinx FPGAs, enabling rapid system initialization and reconfiguration capabilities in embedded applications.

Replacement Considerations

Consult official AMD documentation for verified cross-reference part numbers. Ensure any substitute maintains identical pinout, voltage specifications, and storage capacity. Verify package compatibility before implementation.