XCR3384XL-12FTG256C

Overview

The XCR3384XL-12FTG256C is a CoolRunner XPLA3 Complex Programmable Logic Device (CPLD) manufactured by AMD. It features 256 macrocells, 16 logic blocks, and approximately 6000 usable gates. The device supports system-in-system programming with over 1,000 program/erase cycles. Maximum propagation delay is 10.8 ns. It operates within a supply voltage range of 3.0V to 3.6V and functions at temperatures from 0°C to 70°C. The component is housed in a 256-pin FineLine BGA package.

Feature Summary

• 256 Macrocells with 16 Logic Blocks
• System-In-System Programming Capability
• 10.8 ns Maximum Propagation Delay
• 256-FineLine BGA Package

Applications

• Logic replacement for legacy TTL/CMOS circuits
• Address decoding and bus buffering
• State machine implementation
• Interface protocol conversion

Procurement Notes

This specific part number is obsolete and no longer manufactured. Verification of current availability requires checking authorized distributors for remaining new old stock or approved cross-reference components. Ensure that any substitute parts meet the original electrical specifications and pinout requirements for the design.

Selection Notes

Select this component for designs requiring moderate logic density with low power consumption and high reliability. The XPLA3 family offers robust I/O capabilities suitable for mixed-voltage interfaces. Verify that the 256-pin package footprint is compatible with the PCB layout constraints before finalizing the bill of materials.

Part Context

The XCR3384XL belongs to the CoolRunner XPLA3 series, which succeeded the earlier XPLA2 line. This generation introduced improved performance and higher integration levels while maintaining compatibility with standard JEDEC programming standards. The XL suffix denotes the extended temperature and voltage variants available within the product line.

Replacement Considerations

Direct replacements include the XC3S200A FPGA or other CPLDs from Lattice such as the ispMACH 4000ZE series. Cross-referencing should focus on matching macrocell count, I/O pin count, and package dimensions to ensure mechanical and logical compatibility.