XCVC1502-1LSINSVG1369

Soc System On Chip Overview

The XCVC1502-1LSINSVG1369 is an AMD Versal AI Core Series System-on-Chip FPGA. It utilizes a 1369-ball FCBGA package for surface-mount installation. The device integrates programmable logic, AI Engines, and processing systems to support high-performance computing tasks. It operates within a temperature range of 0°C to +100°C and typically requires a core voltage of approximately 800 mV. This component belongs to the XCVC1502 family, designed for applications requiring significant parallel processing capabilities and low-latency data handling in network and cloud infrastructure environments.

Soc System On Chip Feature Summary

• Integrates AI Engines optimized for machine learning inference and signal processing workloads
• Combines programmable logic with hardened Ethernet subsystems for high-speed networking
• Supports real-time control and complex application execution through integrated processing units

Soc System On Chip Applications

• 5G radio and beamforming infrastructure
• Data center compute acceleration
• Video processing for smart city applications

Soc System On Chip Procurement Notes

Verify the exact suffix configuration against the manufacturer's official datasheet to ensure compatibility with specific board designs. Confirm availability status with authorized distributors as supply levels may vary. Ensure that the selected package type matches the PCB footprint requirements for the 1369-ball FCBGA form factor before finalizing orders.

Soc System On Chip Selection Notes

Select this model when the design requires the specific resource density and I/O count provided by the XCVC1502 tier. Evaluate thermal management solutions early, as high-performance adaptive SoCs generate significant heat during operation. Consider the development toolchain requirements, such as Vivado and Vitis, to ensure software compatibility with the chosen hardware architecture.

Soc System On Chip Part Context

This part belongs to the AMD Versal AI Core series, which targets breakthrough acceleration for 5G, networking, and cloud applications. The series combines AI Engines with programmable logic to deliver high compute performance efficiently. It is positioned alongside other models like the XCVC1702 and XCVP1802, offering distinct resource scales for varying workload demands.

Soc System On Chip Replacement Considerations

Direct replacements are limited within the same family. Consider the XCVC1502-1MSEVSVG1369 or XCVC1502-nsvg1369 variants if pinout and electrical characteristics align. Verify functional equivalence carefully, as differences in speed grades or package options may impact system performance.