XCVC1702-1MLIVSVA2197

Soc System On Chip Overview

The XCVC1702-1MLIVSVA2197 is a Versal Prime Series System-on-Chip FPGA manufactured by AMD. It utilizes an FCBGA-2197 package and operates within a temperature range of -40°C to +110°C. The device integrates dual-core Arm Cortex-A72 application processing units and dual-core Arm Cortex-R5F real-time processing units. Key electrical specifications include a core operating voltage of 800 mV. This component belongs to the Versal adaptive SoC family, combining programmable logic with AI Engines for high-performance computing tasks.

Soc System On Chip Feature Summary

• Integrates software-programmable silicon infrastructure with dedicated compute engines
• Combines Application Processing Units with Real-Time Processing Units for heterogeneous computing
• Supports diverse workloads through adaptable connectivity options

Soc System On Chip Applications

• Data center network acceleration
• SmartNIC implementations
• 5G xHaul networking
• Communications test equipment

Soc System On Chip Procurement Notes

Verify the specific suffix 'MLI' against official AMD documentation to confirm the exact speed grade and commercial/industrial temperature rating. Ensure compatibility with required power delivery designs for the 800 mV core voltage. Confirm availability status directly with authorized distributors as supply chain conditions vary.

Soc System On Chip Selection Notes

Select this model when requiring Versal Prime architecture features with industrial temperature support. Compare against the LSE variant if lower temperature ranges are acceptable, or the MME variant for different performance tiers. Validate that the 2197-pin FCBGA footprint fits the target PCB design constraints.

Soc System On Chip Part Context

This part belongs to the AMD Versal Prime series, designed for networking and storage acceleration markets. It shares architectural similarities with other Versal devices but offers specific resource counts and I/O configurations tailored for high-throughput data plane applications.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package may include other XCVC1702 variants with different suffixes (e.g., LSE, MME) depending on speed grade and temperature requirements. Verify functional equivalence before substitution.