Soc System On Chip XCVC1702-2LSEVSVA2197 product image

XCVC1702-2LSEVSVA2197

$26,352.13
  • Description:IC VERSAL AI-CORE FPGA 2197BGA
  • Series:Versal™ AI Core

SKU:29e024d200d5 Category: Brand:

  
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XCVC1702-2LSEVSVA2197 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-CORE FPGA 2197BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVC1702-2LSEVSVA2197

  • Description:IC VERSAL AI-CORE FPGA 2197BGA
  • Series:Versal™ AI Core
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:-
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:450MHz, 1.08GHz
  • Primary Attributes:Versal™ AI Core FPGA, 1M Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:2197-BFBGA, FCBGA
  • Supplier Device Package:2197-FCBGA (45x45)

Soc System On Chip datasheet and documents for XCVC1702-2LSEVSVA2197

XCVC1702-2LSEVSVA2197

Soc System On Chip Overview

The XCVC1702-2LSEVSVA2197 is a Versal Premium adaptive SoC from AMD, designed for high-performance computing and networking applications. It integrates programmable logic with application processing units (APUs) and real-time processing units (RPUs). Key specifications include approximately 1.4 million system logic cells, 1,368 DSP engines, and dual-core Arm Cortex-A72 APUs alongside dual-core Arm Cortex-R5F RPUs. The device features up to 770 I/O pins, four integrated memory controllers, and supports PCIe Gen4 interfaces. It operates within a temperature range of 0°C to 110°C and utilizes an FCBGA-2197 package.

Soc System On Chip Feature Summary

  • Integrates software-programmable silicon infrastructure with dedicated compute engines for diverse workload acceleration.
  • Combines Versal Premium FPGA fabric with Arm-based processors for flexible hardware-software co-design.
  • Provides extensive connectivity options including high-speed serial transceivers and standard interface ports.

Soc System On Chip Applications

  • Data center network and storage acceleration
  • SmartNIC implementations
  • 5G xHaul and Nx100G Ethernet networking
  • Communications test equipment

Soc System On Chip Procurement Notes

Verify the specific suffix '2L' against official AMD documentation to confirm performance grade and operating temperature range. Ensure compatibility with required power delivery and thermal management solutions for the FCBGA-2197 package. Confirm availability through authorized distributors as lead times may vary based on production schedules.

Soc System On Chip Selection Notes

Select this model when requiring a balance of logic density and processing power for networking or industrial applications. Compare against the '2M' variant if higher frequency operation or extended temperature ranges are not strictly necessary. Evaluate the total system cost including development tools and board design complexity associated with the Versal architecture.

Soc System On Chip Part Context

This component belongs to the AMD Versal Premium series, which targets mid-range adaptive SoC requirements. It sits below the high-end Versal AI Core series in terms of resource count but offers significant flexibility compared to fixed-function ASICs. The part is intended for customers needing rapid prototyping and field-upgradable logic.

Soc System On Chip Replacement Considerations

Direct substitutes within the same package and pinout include other Versal Premium devices such as the XCVC1702-2MSEVSVA2197, provided the electrical characteristics meet the design constraints. Cross-series replacements require careful evaluation of pin compatibility and software migration efforts.

XCVC1702-2LSEVSVA2197XCVC1702-2LSEVSVA2197
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