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XCVC1702-2LSEVSVA2197 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-CORE FPGA 2197BGA. Review the specifications below when checking this part for your BOM.
The XCVC1702-2LSEVSVA2197 is a Versal Premium adaptive SoC from AMD, designed for high-performance computing and networking applications. It integrates programmable logic with application processing units (APUs) and real-time processing units (RPUs). Key specifications include approximately 1.4 million system logic cells, 1,368 DSP engines, and dual-core Arm Cortex-A72 APUs alongside dual-core Arm Cortex-R5F RPUs. The device features up to 770 I/O pins, four integrated memory controllers, and supports PCIe Gen4 interfaces. It operates within a temperature range of 0°C to 110°C and utilizes an FCBGA-2197 package.
Verify the specific suffix '2L' against official AMD documentation to confirm performance grade and operating temperature range. Ensure compatibility with required power delivery and thermal management solutions for the FCBGA-2197 package. Confirm availability through authorized distributors as lead times may vary based on production schedules.
Select this model when requiring a balance of logic density and processing power for networking or industrial applications. Compare against the '2M' variant if higher frequency operation or extended temperature ranges are not strictly necessary. Evaluate the total system cost including development tools and board design complexity associated with the Versal architecture.
This component belongs to the AMD Versal Premium series, which targets mid-range adaptive SoC requirements. It sits below the high-end Versal AI Core series in terms of resource count but offers significant flexibility compared to fixed-function ASICs. The part is intended for customers needing rapid prototyping and field-upgradable logic.
Direct substitutes within the same package and pinout include other Versal Premium devices such as the XCVC1702-2MSEVSVA2197, provided the electrical characteristics meet the design constraints. Cross-series replacements require careful evaluation of pin compatibility and software migration efforts.
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