Soc System On Chip XCVE1752-1LLIVSVA2197 product image

XCVE1752-1LLIVSVA2197

$26,200.19
  • Description:IC VERSAL AI-EDGE FPGA 2197BGA
  • Series:Versal™ AI Core

SKU:a057f5d40037 Category: Brand:

  
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XCVE1752-1LLIVSVA2197 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC VERSAL AI-EDGE FPGA 2197BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCVE1752-1LLIVSVA2197

  • Description:IC VERSAL AI-EDGE FPGA 2197BGA
  • Series:Versal™ AI Core
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Flash Size:-
  • RAM Size:-
  • Peripherals:DDR, DMA, PCIe
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:400MHz, 1GHz
  • Primary Attributes:Versal™ AI Core FPGA, 1M Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:2197-BFBGA, FCBGA
  • Supplier Device Package:2197-FCBGA (45x45)

Soc System On Chip datasheet and documents for XCVE1752-1LLIVSVA2197

XCVE1752-1LLIVSVA2197

Soc System On Chip Overview

The XCVE1752-1LLIVSVA2197 is a Versal Edge adaptive SoC from AMD, designed for edge computing and industrial applications. It integrates programmable logic with AI Engine technology to deliver high performance at low power. The device features an Application Processing Unit (APU) based on dual-core Arm Cortex-A72 processors and a Real-Time Processing Unit (RPU) with dual-core Arm Cortex-R5F processors. It supports various memory interfaces including DDR4 and LPDDR4, along with extensive connectivity options such as PCIe Gen3/Gen4 and high-speed serial transceivers. The component operates within a temperature range of -40°C to +110°C and utilizes an FCBGA package.

Soc System On Chip Feature Summary

  • Integrates Versal AI Engine technology for hardware-accelerated machine learning inference and signal processing tasks.
  • Combines programmable logic with hardened processor subsystems for flexible system architecture.
  • Supports multiple high-speed I/O standards including PCIe and Ethernet for robust connectivity.
  • Optimized for power efficiency in constrained environments through advanced voltage scaling.

Soc System On Chip Applications

  • Industrial automation and control systems
  • Edge AI inference and computer vision
  • Medical imaging devices
  • Automotive infotainment and driver assistance

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official AMD documentation to ensure correct pinout and feature configuration. Confirm RoHS compliance status and lead times directly with authorized distributors or AMD sales representatives prior to ordering. Ensure compatibility with existing board designs regarding thermal requirements and power delivery specifications.

Soc System On Chip Selection Notes

Select this model when edge deployment requires significant parallel processing capabilities alongside traditional CPU functions. Compare resource utilization against higher-tier Versal Prime or HBM series if data center scale is needed. Evaluate power budget constraints carefully as AI Engine usage impacts overall system consumption. Verify interface requirements against available transceivers and memory controllers.

Soc System On Chip Part Context

This part belongs to the AMD Versal Edge family, targeting cost-sensitive and power-constrained markets compared to the Versal Prime and HBM series. It shares the same foundational architecture but offers reduced resource counts optimized for specific edge workloads. The Versal platform unifies FPGA, SoC, and AI capabilities into a single scalable silicon solution.

Soc System On Chip Replacement Considerations

Direct replacements are limited due to the unique Versal architecture. Consider previous generation Zynq UltraScale+ MPSoC devices for simpler logic needs, or higher-end Versal models for increased resources. Validate pin-to-pin compatibility if substituting within the same package type, though functional differences remain significant.

XCVE1752-1LLIVSVA2197XCVE1752-1LLIVSVA2197
$26,200.19
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