XCVM1302-2MLINSVF1369

Soc System On Chip Overview

The AMD XCVM1302-2MLINSVF1369 is a Versal Premium Adaptive SoC FPGA featuring an advanced heterogeneous architecture. It integrates programmable logic, AI Engines, DSP engines, and Arm Cortex-A72/R5F processing subsystems. The device utilizes a 1369-ball FCBGA package with high-density I/O. Key specifications include support for 112 Gb/s SerDes transceivers, DDR4/DDR5 memory interfaces, and PCIe Gen4/Gen5 connectivity. It is designed for high-performance computing, data center acceleration, and complex signal processing applications requiring low latency and high throughput.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining programmable logic, AI Engines, and hardened processors
• Support for 112 Gb/s PAM4 SerDes transceivers for high-speed interconnects
• Integrated DDR memory controllers supporting LPDDR5 and DDR5 standards
• Advanced power management capabilities for optimized energy efficiency

Soc System On Chip Applications

• Data center network acceleration and virtualization
• High-performance computing (HPC) and AI inference
• 5G xHaul and optical transport networks
• Industrial automation and robotics control systems

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official AMD documentation to ensure correct temperature range, packaging type, and lead time classifications. Confirm compatibility with required Vivado and Vitis tool versions before procurement. Check for any regional export control restrictions applicable to this component class.

Soc System On Chip Selection Notes

Select this model based on required AI Engine tile count, DSP engine availability, and number of 112G SerDes lanes. Ensure the PCB design supports the 1369-ball FCBGA thermal and electrical requirements. Validate that the chosen variant meets the specific operating temperature and voltage domain needs of the target application.

Soc System On Chip Part Context

This part belongs to the AMD Versal Premium series, targeting demanding compute-intensive workloads. It sits alongside other Versal variants like Prime and Edge, offering higher computational density and advanced I/O capabilities suitable for next-generation infrastructure and accelerated computing platforms.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements are limited within the Versal family due to varying resource counts and I/O configurations. Consider XCVM1802 or XCVM2602 models if higher resource utilization is needed, ensuring software compatibility via Vivado version updates.