XCZU11EG-L1FFVC1156I

Soc System On Chip Overview

The XCZU11EG-L1FFVC1156I is a Zynq UltraScale+ MPSoC Enhanced Graphics (EG) device manufactured by AMD. It integrates a quad-core ARM Cortex-A53 application processor, dual-core ARM Cortex-R5F real-time processor, and an ARM Mali-400 MP2 GPU with programmable logic fabric. The device utilizes a 16nm FinFET+ process technology and is housed in a 1156-ball FCBGA package. Key electrical parameters include a maximum clock frequency of 1.5 GHz for the A53 cores, 667 MHz for the Mali GPU, and 600 MHz for the R5 cores. It features approximately 653K logic elements, 32.1 Mbit of embedded memory, and supports high-speed peripherals including PCIe Gen3 and USB 3.0.

Soc System On Chip Feature Summary

• Heterogeneous multi-core architecture combining quad-core ARM Cortex-A53, dual-core ARM Cortex-R5F, and ARM Mali-400 MP2 GPU
• Programmable logic fabric with approximately 653K logic elements and 32.1 Mbit embedded memory
• High-speed I/O interfaces including PCIe Gen3 x4, USB 3.0, and Gigabit Ethernet
• Advanced security features including ARM TrustZone, Secure Boot, and hardware key storage

Soc System On Chip Applications

• Industrial automation and control systems requiring real-time processing
• Video surveillance and HMI applications leveraging GPU acceleration
• Next-generation ADAS and automotive infotainment systems
• 5G wireless infrastructure and baseband processing

Soc System On Chip Procurement Notes

Verify the specific suffix 'L1' against official AMD documentation to confirm it denotes the industrial temperature range (-40°C to +100°C) and does not imply additional functional variations. Ensure compatibility with Vivado and Vitis tool versions supporting the Zynq UltraScale+ EG series. Confirm supply chain authenticity through authorized distributors due to potential restricted availability.

Soc System On Chip Selection Notes

Select this model when high-performance graphics processing is required alongside FPGA flexibility. Compare against XCZU9EG or XCZU7EG if lower logic density suffices. Verify that the 1156-ball FCBGA package fits the PCB footprint constraints. Ensure power delivery design accounts for the 850 mV core voltage requirement and dynamic power consumption profiles of the integrated processors.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC Enhanced Graphics (EG) family, designed for applications needing both compute-intensive graphics and programmable logic. It sits above the CG (Compute Graphics) variant in terms of GPU capability but below the EV (Enhanced Video) variant which includes dedicated video codecs. The L1 suffix typically indicates industrial grade temperature rating within the FFVC1156 package option.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package are limited to other EG devices in the 1156-ball FCBGA form factor, such as XCZU11EG-2FFVC1156I or XCZU11EG-3FFVC1156I, depending on speed grade requirements. Cross-family replacements like XCZU9EG require significant schematic and firmware redesign.