XCZU15EG-2FFVC900I

Soc System On Chip Overview

The AMD XCZU15EG-2FFVC900I is a Zynq UltraScale+ MPSoC EG series System-on-Chip utilizing 16nm FinFET+ technology. It integrates a quad-core Arm Cortex-A53 application processor (up to 1.3GHz), dual-core Arm Cortex-R5F real-time processor (up to 600MHz), and an Arm Mali-400 MP2 GPU. The programmable logic section contains over 747K logic cells, 256KB of on-chip RAM with ECC, and up to 16.3Mb of programmable logic RAM. It features integrated GTH/GTY transceivers supporting PCIe Gen3/Gen4 and 100G Ethernet within a 900-pin FCBGA package (31x31mm). The device operates at junction temperatures between -40°C and 100°C.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining quad-core A53, dual-core R5F, and Mali-400 MP2 GPU with 747K+ FPGA logic cells
• High-speed connectivity via integrated GTH/GTY transceivers for PCIe Gen3/Gen4 and 100G Ethernet
• Robust memory subsystem including 256KB PS RAM and 16.3Mb PL RAM with error correction protection

Soc System On Chip Applications

• 5G wireless communication infrastructure
• Advanced Driver Assistance Systems (ADAS)
• Industrial Internet of Things (IIoT) control systems
• Aerospace and defense computing platforms

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms industrial temperature rating (-40°C to 100°C TJ). Confirm package dimensions match the 900-FCBGA (31x31mm) specification. Check moisture sensitivity levels and reflow soldering profiles against current datasheets. Ensure supply chain sources provide valid traceability documentation for this active component.

Soc System On Chip Selection Notes

Select this model when high-density logic resources exceeding 700K cells are required alongside multi-core processing. The EG variant specifically includes the Mali-400 MP2 GPU, distinguishing it from non-GPU variants. Verify that the 900-pin footprint fits the target PCB layout constraints. Consider thermal management requirements given the 16nm process node and high core count density.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ MPSoC EG family, designed for complex heterogeneous computing. It sits above lower-capacity models like the XCZU9CG in terms of logic resources while maintaining the same 900-pin form factor as other EG series devices. It serves as a flagship solution for applications demanding simultaneous real-time control and high-performance data processing.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same package include other EG series devices such as the XCZU11EG-2FFVC900I or XCZU9CG-2FFVC900E, though logic capacity and peripheral counts will differ. Cross-series migration to Zynq-7000 requires significant architectural redesign.