XCZU15EG-L2FFVC900E

Soc System On Chip Overview

The AMD XCZU15EG-L2FFVC900E is a Zynq UltraScale+ MPSoC EG-series system-on-chip utilizing 16nm FinFET+ technology. It integrates a quad-core Arm Cortex-A53 application processor, dual-core Arm Cortex-R5F real-time processor, and an Arm Mali-400 MP2 GPU with 747K+ programmable logic units. The device features 256KB of on-chip RAM and up to 16.3Mb of programmable logic RAM within a 900-pin FCBGA package (31x31mm). Designed for commercial temperature ranges (0°C to 100°C TJ), it supports high-speed interfaces including PCIe Gen3/Gen4 and 100G Ethernet via integrated GTH/GTY transceivers.

Soc System On Chip Feature Summary

• Heterogeneous architecture combining quad-core Cortex-A53 (up to 1.3GHz), dual-core Cortex-R5F (up to 600MHz), and Mali-400 MP2 GPU.
• 747K+ logic cells with 16.3Mb programmable block RAM and ECC protection.
• Integrated high-speed serial transceivers supporting PCIe Gen3/Gen4 and 100G Ethernet.
• Commercial operating temperature range of 0°C to 100°C junction temperature.

Soc System On Chip Applications

• 5G wireless infrastructure base stations
• Advanced Driver Assistance Systems (ADAS)
• Industrial Internet of Things (IIoT) gateways

Soc System On Chip Procurement Notes

Verify the specific suffix 'L2' against official AMD documentation to confirm its exact meaning regarding package or speed grade variations. Ensure compatibility with standard 900-FCBGA footprints and validate thermal requirements for the 31x31mm package in the target design environment.

Soc System On Chip Selection Notes

Select this component when high-density FPGA resources are required alongside ARM processing capabilities. The EG series variant specifically includes the Mali-400 GPU for graphics acceleration. Compare logic cell counts and I/O availability against lower-tier models like the XCZU9EG if resource constraints exist.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG family, which distinguishes itself by integrating a GPU alongside the standard APU and RPU cores. It sits above the E-series in terms of programmable logic density, offering 747K+ logic cells compared to smaller variants, making it suitable for complex signal processing and video applications.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package may include other XCZU15EG variants with different speed grades or temperature ratings (e.g., -1, -2, -3 suffixes). Verify that the logic capacity and memory configuration remain identical before substituting.