XCZU3EG-L1SFVA625I

Soc System On Chip Overview

The AMD XCZU3EG-L1SFVA625I is a Zynq UltraScale+ MPSoC Enhanced Graphics (EG) device featuring a quad-core ARM Cortex-A53 application processor and dual-core ARM Cortex-R5 real-time processor. It integrates an ARM Mali-400 MP2 GPU and approximately 154,000 logic elements within a 625-ball FCBGA package. The A53 cores operate at up to 500 MHz, while the R5 cores reach 1.2 GHz. Key specifications include 1.8 MB of RAM, support for CANbus, I2C, SPI, UART/USART, and USB interfaces, and operation across a temperature range of -40°C to +100°C.

Soc System On Chip Feature Summary

• Quad-core ARM Cortex-A53 MPCore with CoreSight and dual-core ARM Cortex-R5 MPCore with CoreSight
• Integrated ARM Mali-400 MP2 graphics processing unit
• Approximately 154K+ logic elements in Zynq UltraScale+ FPGA fabric
• Supports CANbus, I2C, SPI, UART/USART, and USB connectivity

Soc System On Chip Applications

• Wired and wireless infrastructure systems
• Data center networking equipment
• Aerospace and defense platforms

Soc System On Chip Procurement Notes

Verify component authenticity through authorized AMD distribution channels. Confirm RoHS3 compliance and MSL level 4 handling requirements during storage and assembly. Check for specific engineering change notices or PCN updates that may affect pinout or electrical characteristics prior to final design approval.

Soc System On Chip Selection Notes

Select this EG variant for applications requiring integrated graphics acceleration alongside high-performance processing. Compare against CG series devices if video codecs are unnecessary to reduce cost. Ensure the 625-ball FCBGA package fits the board layout constraints and thermal management strategy for the specified operating temperature range.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG family, designed for enhanced graphics and compute-intensive tasks. It complements the CG series focused on motor control and the EV series optimized for multimedia codecs. The EG series targets infrastructure and industrial markets requiring robust real-time capabilities and graphical output.

Soc System On Chip Replacement Considerations

Direct functional substitutes within the same package and speed grade should be verified via official AMD cross-reference tools. Alternative packages such as SFVC784 or UBVA530 require schematic and layout redesigns.