XCZU55DR-2FSVE1156I

Soc System On Chip Overview

The XCZU55DR-2FSVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a Processing System (PS) with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors, alongside a Programmable Logic (PL) fabric. The device features integrated high-speed analog-to-digital and digital-to-analog converters for direct RF sampling applications. It is housed in a 1156-pin FCBGA package designed for surface-mount installation.

Soc System On Chip Feature Summary

• Integrated RF transceiver subsystem with high-speed ADCs and DACs
• Quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processing cores
• 1156-pin FCBGA package suitable for high-density board layouts

Soc System On Chip Applications

• Software-defined radio systems
• Direct RF sampling radar architectures
• High-performance communication infrastructure

Soc System On Chip Procurement Notes

Verify the specific suffix 'IES9819' or similar against official AMD documentation to confirm exact speed grade and temperature range. Standard XCZU55DR devices typically follow industrial temperature specifications. Confirm availability status directly with authorized distributors as supply levels fluctuate.

Soc System On Chip Selection Notes

Select this model when both significant FPGA logic resources and high-throughput RF data conversion are required on a single chip. Ensure the design supports the thermal requirements of the FCBGA package. Compare against the XCZU47DR or XCZU67DR if different logic densities or I/O counts are needed.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ RFSoC family, which combines Xilinx FPGA technology with ARM processor cores and RF capabilities. It serves as a system-on-chip solution for complex signal processing tasks that previously required multiple discrete components.

Soc System On Chip Replacement Considerations

Cross-reference with XCZU47DR-2FFVE1156I or XCZU67DR-2FSVE1156I for alternative logic densities within the same package family. Verify pin compatibility and thermal performance before substituting.