XCZU57DR-L1FFVE1156I

Soc System On Chip Overview

The XCZU57DR-L1FFVE1156I is a Zynq UltraScale+ RFSoC device manufactured by AMD. It integrates a Processing System with quad-core ARM Cortex-A53 and dual-core ARM Cortex-R5 processors, alongside programmable logic and integrated RF transceivers. The device features 8 RF-ADC channels and 8 RF-DAC channels, supporting high-speed data conversion up to 5 GSPS for ADCs and 9.85 GSPS for DACs. It utilizes a 1156-pin FCBGA package and operates within an industrial temperature range of -40°C to +100°C.

Soc System On Chip Feature Summary

• Integrated RF subsystem with 8-channel 14-bit 5 GSPS RF-ADCs and 8-channel 14-bit 9.85 GSPS RF-DACs
• Processing System includes quad-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5F MPCore
• Programmable Logic contains approximately 570K logic cells and extensive DSP slices
• Supports direct RF sampling from 1 MHz to 6 GHz without external mixers

Soc System On Chip Applications

• Software-defined radio (SDR) systems
• Military electronic warfare and signal intelligence
• 5G base station digital front ends
• Phased array radar systems

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix (e.g., L1) against design timing requirements. Confirm RoHS compliance status via the manufacturer's official datasheet. Ensure ESD precautions are followed during handling due to moisture sensitivity level classification. Cross-reference the full part number with AMD's current production lifecycle status to confirm availability.

Soc System On Chip Selection Notes

Select this model when high-channel-count RF digitization is required on a single chip. Compare logic resource counts against algorithm complexity. Verify that the 1156-pin FCBGA footprint matches the PCB layout constraints. Ensure the thermal design supports the power dissipation characteristics of the integrated RF blocks at maximum operating temperatures.

Soc System On Chip Part Context

This component belongs to the Zynq UltraScale+ RFSoC family, which combines Xilinx FPGA technology with ARM processing cores and direct RF conversion capabilities. It is designed for applications requiring tight synchronization between multiple analog channels and high-throughput digital signal processing within a compact form factor.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements within the same package may include other variants in the XCZU57DR series with different speed grades or temperature ranges. Upgrades to higher-capacity RFSoC devices like the XCZU47DR or XCZU67DR require significant schematic and layout redesigns due to differing I/O counts and pin assignments.